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XC2VP4-5FFG672C

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Product Not Recommended For New Designs 1 R DS083 (v5.0) June 21, 2011 Virtex-II Pro and Virtex-II Pro X Platform FPGAs: Complete Data Sheet Product Specification 0 Module 1: Introduction and Overview Module 3: DC and Switching Characteristics 10 pages 59 pages • • • • • • • • • • • • • Summary of Features General Description Architecture IP Core and Reference Support Device/Package Combinations and Maximum I/O Ordering Information Module 2: Functional Description Electrical Characteristics Performance Characteristics Switching Characteristics Pin-to-Pin Output Parameter Guidelines Pin-to-Pin Input Parameter Guidelines DCM Timing Parameters Source-Synchronous Switching Characteristics 60 pages Module 4: Pinout Information • 302 pages • • • • Functional Description: RocketIO™ X Multi-Gigabit Transceiver Functional Description: RocketIO Multi-Gigabit Transceiver Functional Description: Processor Block Functional Description: PowerPC™ 405 Core Functional Description: FPGA - • • Input/Output Blocks (IOBs) Digitally Controlled Impedance (DCI) On-Chip Differential Termination Configurable Logic Blocks (CLBs) 3-State Buffers CLB/Slice Configurations 18-Kb Block SelectRAM™ Resources 18-Bit x 18-Bit Multipliers Global Clock Multiplexer Buffers Digital Clock Manager (DCM) • • Pin Definitions Pinout Tables - FG256/FGG256 Wire-Bond Fine-Pitch BGA Package FG456/FGG456 Wire-Bond Fine-Pitch BGA Package FG676/FGG676 Wire-Bond Fine-Pitch BGA Package FF672 Flip-Chip Fine-Pitch BGA Package FF896 Flip-Chip Fine-Pitch BGA Package FF1148 Flip-Chip Fine-Pitch BGA Package FF1152 Flip-Chip Fine-Pitch BGA Package FF1517 Flip-Chip Fine-Pitch BGA Package FF1696 Flip-Chip Fine-Pitch BGA Package FF1704 Flip-Chip Fine-Pitch BGA Package Routing Configuration IMPORTANT NOTE: Page, figure, and table numbers begin at 1 for each module, and each module has its own Revision History at the end. Use the PDF "Bookmarks" pane for easy navigation in this volume. © 2000–2011 Xilinx, Inc. All rights reserved. XILINX, the Xilinx logo, the Brand Window, and other designated brands included herein are trademarks of Xilinx, Inc. PowerPC is a trademark of IBM Corp. and is used under license. All other trademarks are the property of their respective owners. DS083 (v5.0) June 21, 2011 Product Specification www.xilinx.com 1

ブランド

XILINX

会社名

Xilinx, Inc

本社国名

U.S.A

事業概要

プログラマブルロジックデバイスの開発および販売

供給状況

 
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