GL610T
GL610T
Chip Type Infrared Emitting Diode
s Features
s Outline Dimensions
1. Subminiature (Dimensions : 1.6 × 1.6 × 0.8mm)
2. Thin type (Thickness : 0.8mm)
3. Taped model (4 000pcs./reel)
4. Leadless type
(Unit : mm)
0.8
1.6
Transparent resin
1.2
1.0
s Applications
s Absolute Maximum Ratings
Parameter
Forward current
*1
Peak forward current
Reverse voltage
Power dissipation
Operating temperature
Storage temperature
*2
Soldering temperature
Symbol
Rating
IF
50
500
IFM
VR
6
P
150
Topr
−25 to +85
Tstg
−25 to +100
260
Tsol
(Ta=25˚C)
Unit
mA
mA
V
mW
˚C
˚C
˚C
0.3
0.8
0.5
0.3
1. Small and thin type remote control units
2. Tape end detectors for VCR, VCR camera
3. Light source of tatch panel for car navigation system
4. Portable equipment
0.3
1
2
1
1
Marking of chip position
2
2
Cathode
Anode
g Unspecified tolerance : ±0.1mm
Plating area
*1 Pulse width=100µs, Duty ratio=0.01
*2 Hand soldering temperature, for MAX. 3s
Notice
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Internet Internet address for Electronic Components Group http://www.sharp.co.jp/ecg/
