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M5223AFP
COMMUNICATIONS MODULES & SUBSYSTEMS OC-3 Small Form Factor (SFF) Transceiver CF2 Series Key Features • Temperature ranges: 0 to 70 °C, -20 to 85 °C, and -40 to 85 °C • Single 3.3 V power supply • LV-PECL data input and receiver output levels • TTL or PECL signal detect • Multisource Agreement (MSA)-conforming 2x5 and 2x10 SFF package • Electromagnetic interference (EMI) meets FCC Class B limit • Class 1 Laser Safety conformance • Meets mezzanine height standard of 9.8 mm • Wave-solderable/aqueous-washable • Industry-standard duplex-LC optical connector • Operates with 9/125 µm single-mode optical fibers • Available in IR1 (15 km) Applications • Metro • Access • Wide area networks The JDSU CF2 Series OC-3 transceiver is a duplex-LC transceiver designed for use in SONET OC-3 and SDH STM-1 applications. It operates with a single 3.3 V power supply. The unit conforms to the industry-standard 2x5 and 2x10 footprints and meets the mezzanine height requirement of 9.8 mm. Compliance Each transceiver consists of an optical subassembly housing both the transmitter and the receiver, and an electrical subassembly. All are packaged together with a top metal cover and bottom shield. • Compliant with SONET OC-3 and ITU-T G.957 SDH STM-1 specifications (155 Mb/s data rate) The optical subassembly comprises two parts: the transmitter side has a highperformance 1300 nm Fabry-Perot (FP) or 1550 nm distributed feedback (DFB) laser and back facet monitor. The receiver side has an InGaAs PIN and a preamplifier. All CF2 Series OC-3 transceivers also include a signal detect circuit, which provides either a Positive Emitter Coupled Logic (PECL) or TTL logic high output when a usable input optical signal level is detected. NORTH AMERICA : 800 498-JDSU (5378) WORLDWIDE : +800 5378-JDSU WEBSITE : www.jdsu.com
MITSUBISHI
NECエレクトロニクスは平成14年にNECから、ルネサスは平成15年に日立製作所及び三菱電機からそれぞれ分離独立する形で設立された半導体専業企業であり両者は合併した。
RENESAS
ルネサス エレクトロニクス株式会社
日本
2010年(平成22年)4月に設立された大手半導体メーカー。半導体製品の研究開発・製造・販売・サービス。主力製品は、マイコン(CISC、RISC)、パワーデバイス、アナログ&ミックスドシグナルIC、汎用IC、高周波デバイス、光半導体、車載用LSI、産業用LSI、メモリ、ASIC、USB ASSP、システムLSI
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