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部品型式

DA82562ZET

製品説明
仕様・特性

82562EZ 10/100 Mbps Platform LAN Connect (PLC) Networking Silicon Datasheet Product Features ■ ■ ■ ■ ■ ■ ■ ■ ■ IEEE 802.3 10BASE-T/100BASE-TX compliant physical layer interface IEEE 802.3u Auto-Negotiation support Digital Adaptive Equalization control Link status interrupt capability XOR tree mode support 3-port LED support (speed, link and activity) 10BASE-T auto-polarity correction LAN Connect interface 82540EM layout compatible ■ ■ ■ ■ ■ ■ ■ ■ ■ Diagnostic loopback mode 1:1 transmit transformer ratio support Low power (less than 300 mW in active transmit mode) Reduced power in “unplugged mode” (less than 50 mW) Automatic detection of “unplugged mode” 3.3 V device Thin BGA 15mm2 package 82562EX with Alert on LAN support available Lead-freea 196-pin Ball Grid Array (BGA). (Devices that are lead-free are marked with a circled “e1” and have the product code: LUxxxxxx.) a.This device is lead-free. That is, lead has not been intentionally added, but lead may still exist as an impurity at <1000 ppm. The Material Declaration Data Sheet, which includes lead impurity levels and the concentration of other Restriction on Hazardous Substances (RoHS)-banned materials, is available at: ftp://download.intel.com/design/packtech/material_content_IC_Package.pdf#pagemode=bookmark In addition, this device has been tested and conforms to the same parametric specifications as previous versions of the device. For more information regarding lead-free products from Intel Corporation, contact your Intel Field Sales representative. Revision 1.5 January 2005

ブランド

INTEL

会社名

Intel Corporation

本社国名

U.S.A

事業概要

マイクロプロセッサ・チップセット・フラッシュメモリなどの開発・製造・販売 世界CPU市場ではここ数年80%近いシェアを維持している。

供給状況

 
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