6.2×6.5mm TACT Switch (SMD)
SKHM Series
Surface mounting type with 3.1mm total height suitable for high density mounting.
Power
Push
Slide
Rotary
Encoders
Detector
Features
Dual-in-line
Package Type
Multi Control
Devices
●
●
●
Applications
Reflow solderable.
Available with anti-ESD ground terminal.
Packaged with a 12mm wide embossed taping.
●
For operating various electronic devices such as audio devices,
office equipment, communication devices, measuring
instruments, TVs, video recorders, etc.
TACT
CustomProducts
Products Line
Products No.
Operating
force
SKHMPSE010
0.98N
SKHMPWE010
Sharp
Feeling
Soft
Feeling
Operating
direction
1.57N
SKHMPUE010
Travel
(mm)
Rating
(max.)
0.25
50mA
12V DC
Operating life
(5mA 5V DC)
Initial contact
resistance
500,000 cycles
2.35N
Vertical
Stem color
Brown
100mΩ
max.
300,000 cycles
200,000 cycles
Green
Red
Dimensions
Unit:mm
Snap-in
Type
PC board land dimensions
(Viewed from switch mounting face)
Style
Surface
Mount Type
Radial
Type
8
1
2
5
0.7
6.2
6.5
Ground terminal land
3
4.5
0.7
0.7
4.5
8.4
4
ø3
5-1.4×1.6 land
3.1
2.6
Stem
Circuit Diagram
1
2
3
5
4
For detailed specifications, see P.415
For soldering conditions, see P.416
For specifications for the taping package, see P.418
384
TACT Switches
Soldering Conditions
Condition for Reflow
Available for Surface Mount Type.(Except SKHM, SKHU, SKRM, SKRR Series)
1. Heating method: Double heating method with infrared heater.
2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA
(K) CC
or (T) soldering portion
at
(copper foil surface) A heat resisting tape
.
Power
Push
should be used for fixed measurement.
3. Temperature profile
Temperature (˚C )
Slide
260˚C max. 3 sec max.
Rotary
230˚C
180
Encoders
150
Detector
Time
Dual-in-line
Package Type
120 sec max. pre-heating )
(
Multi Control
Devices
3 to 4min.
TACT
CustomProducts
40s max.
Time inside soldering equipment
Notes
1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where
the PC board's temperature greatly differs from that of the switch, depending on the PC board's material, size,
thickness, etc. The above-stated conditions shall also apply to switch surface temperatures.
2. Soldering conditions differ depending on reflow soldering machines. You are requested to verify the soldering
conditions thoroughly beforehand.
Sharp
Feeling
Soft
Feeling
Snap-in
Type
Conditions for Auto-dip
Manual Soldering
Available for Snap-in Type and Radial Type
Available for Manual Soldering Type
(Except SKHJ, SKHL, SKQC, SKQJ, SKQK, SKEG series)
Surface
Mount Type
Items
Items
Condition
Flux built-up
Mounting surface
should not be coated with flax
Soldering temperature
350℃max.
Continuous soldering time
Radial
Type
Condition
3s max.
Ambient temperature of the soldered
surface of PC board.
Preheating temperature
100℃ max.
Preheating time
60s max.
Soldering temperature
260℃ max.
Continuous dipping time
5s max.
Number of soldering
2times max.
Notes
1.
2.
3.
4.
5.
416
Consult with us for TACT switch washing conditions.
Prevent flux penetration from the top side of the TACT switch.
Switch terminals and a PC board should not be coated with flux prior to soldering.
The second soldering should be done after the switch returns to normal temperature.
Use the flux with a specific gravity of at least 0.82.
(EC-19s-8 by TAMURA Corporation, or their equivalents.)