SV/H Series
SV/H Series Tantalum Chip Capacitors
(Higher Performance)
DIMENSIONS [mm]
PERFORMANCE CHARACTERISTICS
L
W1
L
W1
W1
Operating temperature range
−55 to +125°C with proper voltage
derating as shown in the following table.
H
H
H
L
Y
Z
W2
W2
W2
DC working voltage and surge voltage
Z
Z
[A cases]
Z
Z
Rated voltage
Z
Working
[B2 cases]
[C, D2 cases]
Surge
(Unit: mm)
Case
EIA code
Code
L
W1
W2
H
Z
Y
−
A
3216
3.2 ± 0.2
1.6 ± 0.2
1.2 ± 0.1
1.6 ± 0.2
0.8 ± 0.2
B2
3528
3.5 ± 0.2
2.8 ± 0.2
2.3 ± 0.1
1.9 ± 0.2
0.8 ± 0.2
−
C
6032
6.0 ± 0.2
3.2 ± 0.2
2.2 ± 0.1
2.5 ± 0.2
1.3 ± 0.2
0.4 C
D2
5846
5.8 ± 0.2
4.6 ± 0.2
2.4 ± 0.1
3.2 ± 0.2
1.3 ± 0.2
−
DC rated
voltage
(Vdc)
µF
10
16
20
0.68
3.3
C
C
C
C
C
22
C
C
B2
B2
10
33
B2
B2
6.8
15
B2
A
A
10
16
20 25
35
V
10
16
20 25
35
V
at 125°C 6.3
10
13 16
22
V
at 85°C
20
26 33
46
V
13
Capacitance (at 20°C, 120 Hz)
Range:
0.47 µF to 33 µF
Tolerance:
±20%, ±10%
Capacitance change with temperature
Not to exceed −12% at −55°C, +12%
at 85°C, and +15% at 125°C
Tangent of loss angle (at 20°C, 120 Hz)
0.47 µF to 4.7 µF: less than 0.04
6.8 µF to 33 µF: less than 0.06
DC leakage current (at 20°C)
0.01 C•VNote µA or 0.5 µA, whichever is greater
B2
A
1.5
4.7
B2
A
1
2.2
35
A
0.47
25
at 85°C
Damp heat (85% RH at 85°C, 56 days (1344 h))
Capacitance change: ±10%
Tangent of loss angle: 150% of
initial requirements
DC leakage current:
initial requirements
D2
D2
D2
D2
D2
Endurance (at 85°C, DC rated voltage, 2000 h)
Capacitance change: ±10%
Tangent of loss angle: initial requirements
DC leakage current:
125% of
initial requirements
D2
Resistance to soldering heat
(solder reflow and solder dip at 260°C, 10 s.)
Capacitance change: ± 5%
Tangent of loss angle: initial requirements
DC leakage current:
initial requirements
Rapid change of temperature (at −55 to 125°C,
1000 cycles)
Capacitance change: ± 10%
Leakage current:
initial requirements
Tangent of loss angleL initial requirements
Note: Product of capacitance in µF and voltage in V.
See pages 25 and 26 for taping specifications.
EC0171EJUV0SG00
17