R8C/24 Group, R8C/25 Group
SINGLE-CHIP 16-BIT CMOS MCU
1.
REJ03B0117-0300
Rev.3.00
Feb 29, 2008
Overview
These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series
CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements
sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capable of
executing instructions at high speed.
Furthermore, the R8C/25 Group has on-chip data flash (1 KB x 2 blocks).
The difference between the R8C/24 Group and R8C/25 Group is only the presence or absence of data flash. Their
peripheral functions are the same.
1.1
Applications
Electronic household appliances, office equipment, audio equipment, consumer products, etc.
Rev.3.00 Feb 29, 2008
REJ03B0117-0300
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