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74LVTH16244A

製品説明
仕様・特性

Revised June 2005 74LVT16244 • 74LVTH16244 Low Voltage16-Bit Buffer/Line Driver with 3-STATE Outputs General Description Features The LVT16244 and LVTH16244 contain sixteen non-inverting buffers with 3-STATE outputs designed to be employed as a memory and address driver, clock driver, or bus oriented transmitter/receiver. The device is nibble controlled. Individual 3-STATE control inputs can be shorted together for 8-bit or 16-bit operation. The LVTH16244 data inputs include bushold, eliminating the need for external pull-up resistors to hold unused inputs. s Input and output interface capability to systems at 5V VCC These buffers and line drivers are designed for low-voltage (3.3V) VCC applications, but with the capability to provide a TTL interface to a 5V environment. The LVT16244 and LVTH16244 are fabricated with an advanced BiCMOS technology to achieve high speed operation similar to 5V ABT while maintaining a low power dissipation s Bushold data inputs eliminate the need for external pull-up resistors to hold unused inputs (74LVTH16244), also available without bushold feature (74LVT16244). s Live insertion/extraction permitted s Power Up/Down high impedance provides glitch-free bus loading s Outputs source/sink 32 mA/64 mA s Functionally compatible with the 74 series 16244 s Latch-up performance exceeds 500 mA s ESD performance: Human-body model !2000V Machine model !200V Charged-drive model !1000V s Also packaged in plastic Fine-Pitch Ball Grid Array (FBGA) Ordering Code: Order Number Package Number Package Description 74LVT16244G (Note 1)(Note 2) BGA54A (Preliminary) 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide 74LVT16244MEA (Note 2) MS48A 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide 74LVT16244MTD (Note 2) MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide 74LVTH16244G (Note 1)(Note 2) BGA54A 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide 74LVTH16244MEA (Note 2) MS48A 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide 74LVTH16244MTD (Note 2) MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide Note 1: Ordering code “G” indicates Trays. Note 2: Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code. Logic Symbol © 2005 Fairchild Semiconductor Corporation DS500151 www.fairchildsemi.com 74LVT16244 • 74LVTH16244 Low Voltage16-Bit Buffer/Line Driver with 3-STATE Outputs March 1999

ブランド

TI

会社名

Texas Instruments Incorporated

本社国名

U.S.A

事業概要

世界25ヶ国以上に製造・販売拠点を有する国際的な半導体企業であり、デジタル情報家電、ワイヤレス、ブロードバンド市場に欠かせないデジタル信号処理を行うDSPと、それに関連するアナログIC、マイクロコントローラを主力製品としている。

供給状況

 
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