BTVM Series
0.5mm Pitch Connectors for
3.0mm Board-to-Board Spacing
Product Description
BTVM Series 0.5mm (0.020 inch) pitch connectors are
designed for parallel board stacking applications.
These two-piece, surface mount connectors provide a
low mated height of 3.0mm (0.118 inch). BTVM Series
connectors are also designed to exceed impact
and shock test requirements that are common for
portable electronic products, such as mobile phones.
Currently, connectors are available in 20, 32, 40, and
60 positions.
Features
• Dual rows of contacts on 0.5mm (0.020 inch) pitch
• Mated height of 3.0mm (0.118 inch)
• Thick-walled shroud on receptacle
• Blade and cantilevered beam contact structures
• Gold contact finish with nickel underplate
• Flat top surfaces on housings for pickup with
vacuum nozzle
• Tape-and-reel packaging
Target Markets
Benefits
• Suitable for applications that require compact
interconnects because of their close contact
spacing and low mated height
• Increased receptacle body strength withstands
damage from high impact or mechanical shock
• Blade-on-beam contact design with gold finish
provides reliable electrical performance
• Flat top surfaces eliminate the need for pickup
covers that must be removed after soldering
• Embossed tape packaging supports automated
connector placement
s
Americas Tel.: (800) 237-2374; 717-938-7200
• Consumer
• Industrial
Target Applications
• Mobile Phone
• Personal Digital Assistant (PDA)
• Pager
• Handheld Computer (HPC)
• Bar-code Scanner
• Camcorder
• Portable CD Player
• Digital Camera
Internet: www.fciconnect.com
s Europe Tel.: 31-73-6206-911
s
Asia/Pacific Tel.: 65-549-6666
