MMSZ52xxxT1G Series,
SZMMSZ52xxxT1G Series
Zener Voltage Regulators
500 mW SOD−123 Surface Mount
Three complete series of Zener diodes are offered in the convenient,
surface mount plastic SOD−123 package. These devices provide a
convenient alternative to the leadless 34−package style. Zener voltage
in this series are specified with device junction in thermal equilibrium.
www.onsemi.com
Features
• 500 mW Rating on FR−4 or FR−5 Board
• Wide Zener Reverse Voltage Range − 2.4 V to 110 V @ Thermal
•
•
•
•
•
•
SOD−123
CASE 425
STYLE 1
Equilibrium*
Package Designed for Optimal Automated Board Assembly
Small Package Size for High Density Applications
General Purpose, Medium Current
ESD Rating of Class 3 (> 16 kV) per Human Body Model
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
These are Pb−Free Devices*
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic case
FINISH: Corrosion resistant finish, easily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 Seconds
POLARITY: Cathode indicated by polarity band
FLAMMABILITY RATING: UL 94 V−0
Total Power Dissipation on FR−5 Board,
(Note 1) @ TL = 75°C
Derated above 75°C
2
Anode
MARKING DIAGRAM
1
xx
M
G
xx MG
G
= Device Code (Refer to page 3)
= Date Code
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
MAXIMUM RATINGS
Rating
1
Cathode
Package
Shipping†
Max
Units
MMSZ52xxBT1G,
SZMMSZ52xxBT1G
SOD−123
(Pb−Free)
3,000 /
Tape & Reel
500
6.7
Symbol
mW
mW/°C
MMSZ52xxCT1G,
SZMMSZ52xxCT1G
SOD−123
(Pb−Free)
3,000 /
Tape & Reel
PD
Thermal Resistance, Junction−to−Ambient
(Note 2)
RqJA
340
°C/W
MMSZ52xxBT3G,
SZMMSZ52xxBT3G
SOD−123
(Pb−Free)
10,000 /
Tape & Reel
Thermal Resistance, Junction−to−Lead
(Note 2)
RqJL
150
°C/W
MMSZ52xxCT3G,
SZMMSZ52xxCT3G
SOD−123
(Pb−Free)
10,000 /
Tape & Reel
TJ, Tstg
−55 to +150
°C
Junction and Storage Temperature Range
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR−5 = 3.5 X 1.5 inches, using the minimum recommended footprint.
2. Thermal Resistance measurement obtained via infrared Scan Method.
*For additional info on thermal equilibrium, please download, ON Semiconductor
TVS/Zener Theory and Design Considerations Handbook, HBD854/D.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2015
March, 2015 − Rev. 14
1
Publication Order Number:
MMSZ5221BT1/D
