SN74AUC2G66
DUAL BILATERAL ANALOG SWITCH
www.ti.com
SCES507 – NOVEMBER 2003 – REVISED DECEMBER 2005
FEATURES
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DCT OR DCU PACKAGE
(TOP VIEW)
Available in the Texas Instruments
NanoStar™ and NanoFree™ Packages
Operates at 0.8 V to 2.7 V
Sub-1-V Operable
Max tpd of 0.5 ns at 1.8 V
Low Power Consumption, 10 µA at 2.7 V
High On-Off Output Voltage Ratio
High Degree of Linearity
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Performance Tested Per JESD 22
– 2000-V Human-Body Model
(A114-B, Class II)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
1A
1B
2C
GND
1
8
2
7
3
6
4
5
VCC
1C
2B
2A
YEP OR YZP PACKAGE
(BOTTOM VIEW)
GND
2C
1B
1A
4 5
3 6
2 7
1 8
2A
2B
1C
VCC
DESCRIPTION/ORDERING INFORMATION
This dual analog switch is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.1-V to 2.7-V VCC
operation.
The SN74AUC2G66 can handle both analog and digital signals. It permits signals with amplitudes of up to 2.7-V
(peak) to be transmitted in either direction.
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for
analog-to-digital and digital-to-analog conversion systems.
ORDERING INFORMATION
PACKAGE (1)
TA
ORDERABLE PART NUMBER
TOP-SIDE MARKING (2)
NanoStar™ – WCSP (DSBGA)
0.23-mm Large Bump – YEP
(2)
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
Tape and reel
SN74AUC2G66YZPR
Tape and reel
SN74AUC2G66DCTR
U66_ _ _
VSSOP – DCU
(1)
SN74AUC2G66YEPR
SSOP – DCT
–40°C to 85°C
Tape and reel
Tape and reel
SN74AUC2G66DCUR
U66_
_ _ _U6_
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
FUNCTION TABLE
CONTROL
INPUT
(C)
SWITCH
L
OFF
H
ON
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2003–2005, Texas Instruments Incorporated
