MMSZ4xxxT1G Series,
SZMMSZ4xxxT1G Series
Zener Voltage Regulators
500 mW SOD−123 Surface Mount
Three complete series of Zener diodes are offered in the convenient,
surface mount plastic SOD−123 package. These devices provide a
convenient alternative to the leadless 34−package style.
http://onsemi.com
Features
•
•
•
•
•
•
•
500 mW Rating on FR−4 or FR−5 Board
Wide Zener Reverse Voltage Range − 1.8 V to 43 V
Package Designed for Optimal Automated Board Assembly
Small Package Size for High Density Applications
ESD Rating of Class 3 (> 16 kV) per Human Body Model
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
These Devices are Pb−Free and are RoHS Compliant*
SOD−123
CASE 425
STYLE 1
1
Cathode
MARKING DIAGRAM
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic case
FINISH: Corrosion resistant finish, easily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
1
260°C for 10 Seconds
POLARITY: Cathode indicated by polarity band
FLAMMABILITY RATING: UL 94 V−0
xx
M
G
MAXIMUM RATINGS
Rating
Total Power Dissipation on FR−5 Board,
(Note 1) @ TL = 75°C
Derated above 75°C
xx M G
G
= Device Code (Refer to page 3)
= Date Code
= Pb−Free Package
(Note: Microdot may be in either location)
Symbol
PD
Thermal Resistance, (Note 2)
Junction−to−Ambient
RqJA
Thermal Resistance, (Note 2)
Junction−to−Lead
RqJL
Junction and Storage Temperature Range
2
Anode
TJ, Tstg
Max
Units
500
6.7
mW
mW/°C
ORDERING INFORMATION
Device
Package
Shipping†
°C/W
150
−55 to
+150
MMSZ4xxxT1G
SOD−123
(Pb−Free)
3,000 /
Tape & Reel
°C/W
340
SZMMSZ4xxxT1G
SOD−123
(Pb−Free)
3,000 /
Tape & Reel
MMSZ4xxxT3G
SOD−123
(Pb−Free)
10,000 /
Tape & Reel
SZMMSZ4xxxT3G
SOD−123
(Pb−Free)
10,000 /
Tape & Reel
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR−5 = 3.5 X 1.5 inches, using the minimum recommended footprint.
2. Thermal Resistance measurement obtained via infrared Scan Method.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2013
November, 2013 − Rev. 10
1
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
this data sheet.
Publication Order Number:
MMSZ4678T1/D