MMSZxxxT1 Series,
SZMMSZxxxT1G Series
Zener Voltage Regulators
500 mW SOD−123 Surface Mount
Three complete series of Zener diodes are offered in the convenient,
surface mount plastic SOD−123 package. These devices provide a
convenient alternative to the leadless 34−package style.
Features
•
•
•
•
•
•
•
•
500 mW Rating on FR−4 or FR−5 Board
Wide Zener Reverse Voltage Range − 2.4 V to 56 V
Package Designed for Optimal Automated Board Assembly
Small Package Size for High Density Applications
ESD Rating of Class 3 (>16 kV) per Human Body Model
AEC−Q101 Qualified and PPAP Capable
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
Pb−Free Packages are Available
http://onsemi.com
1
Cathode
2
1
SOD−123
CASE 425
STYLE 1
Mechanical Characteristics
CASE: Void-free, transfer-molded, thermosetting plastic case
FINISH: Corrosion resistant finish, easily Solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 Seconds
POLARITY: Cathode indicated by polarity band
FLAMMABILITY RATING: UL 94 V−0
Total Power Dissipation on FR−5 Board,
(Note 1) @ TL = 75°C
Derated above 75°C
Symbol
PD
MARKING DIAGRAM
1
xx M G
G
xx = Device Code
M = Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
MAXIMUM RATINGS
Rating
2
Anode
Max
Unit
500
6.7
mW
mW/°C
ORDERING INFORMATION
Device
Package
Shipping†
Thermal Resistance, Junction−to−Ambient
(Note 2)
RqJA
340
°C/W
MMSZxxxT1
SOD−123
(Pb−Free)
3000/Tape & Reel
Thermal Resistance, Junction−to−Lead
(Note 2)
RqJL
150
°C/W
SZMMSZxxxT1G
SOD−123
(Pb−Free)
3000/Tape & Reel
TJ, Tstg
−55 to +150
°C
MMSZxxxT3
SOD−123
(Pb−Free)
10,000/Tape &
Reel
SZMMSZxxxT3G
SOD−123
(Pb−Free)
10,000/Tape &
Reel
Junction and Storage Temperature Range
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−5 = 3.5 X 1.5 inches.
2. Thermal Resistance measurement obtained via infrared Scan Method.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
this data sheet.
© Semiconductor Components Industries, LLC, 2011
November, 2011 − Rev. 10
1
Publication Order Number:
MMSZ2V4T1/D
