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部品型式

IRL3103D1S

製品説明
仕様・特性

PD- 9.1558A IRL3103D1S FETKYTM MOSFET & SCHOTTKY RECTIFIER l l l l l Co-packaged HEXFET® Power MOSFET and Schottky Diode Generation 5 Technology Logic Level Gate Drive Minimize Circuit Inductance Ideal For Synchronous Regulator Application D VDSS = 30V RDS(on) = 0.014Ω G ID = 64A S Description The FETKY family of co-packaged HEXFET power MOSFETs and Schottky Diodes offer the designer an innovative board space saving solution for switching regulator applications. A low on resistance Gen 5 MOSFET with a low forward voltage drop Schottky diode and minimized component interconnect inductance and resistance result in maximized converter efficiencies. The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible onresistance in any existing surface mount package. The D2Pak is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application. D 2 Pak T O -26 2 Absolute Maximum Ratings Parameter ID @ TC = 25°C ID @ TC = 100°C IDM PD @TA = 25°C PD @TC = 25°C VGS TJ TSTG Max. Continuous Drain Current, VGS @ 10Vƒ Continuous Drain Current, VGS @ 10Vƒ Pulsed Drain Current ƒ Power Dissipation Power Dissipation Linear Derating Factor Gate-to-Source Voltage Operating Junction and Storage Temperature Range Soldering Temperature, for 10 seconds 64 45 220 3.1 89 0.56 ± 16 -55 to + 150 Units A W W W/°C V °C 300 (1.6mm from case ) Thermal Resistance Parameter RθJC RθJA Junction-to-Case Junction-to-Ambient ( PCB Mounted,steady-state)** Typ. Max. Units ––– ––– 1.4 40 °C/W 4/2/98

ブランド

IR

会社名

International Rectifier

本社国名

U.S.A

事業概要

パワー・マネジメント向けの半導体製品を中心とする電気機器の製造販売やソリューションを提供する。

供給状況

 
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