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PEB2050P
High Temperature Thick Film Chip Resistors HTC Series • • • • • Operation to 200°C Excellent high temperature stability Improved working voltage ratings Pb-free wrap-around terminations Standard chip sizes available from 1206 to 2512 Electrical Data Characteristic 1206 2010 2512 1W to 10MW; ±1%, ±5% Resistance Range 10W to 1MW; ±0.5%, ±5%, ±1% 150°C Power Rating 200mW 500mW 750mW Max Voltage Rating 200V 400V 500V Absolute TCR ± 100ppm/°C Operating Temperature Pad/Trace Area1 -55°C to +200°C 80mm2 Termination 200mm2 300mm2 Wrap-around Pb-free with leach resistant Ni barrier Note1 : Recommended minimum pad and adjacent trace area for each termination for rated power on FR4 PCB. Environmental Data Test Method Specification Maximum2 Typical MIL-STD-202 Method 108 (Rated Power for 1000hrs @ 150°C) 1.00% 0.25% 1000 hours @ 200°C 1.00% 0.20% Short Time Overload MIL-PRF-55342H (6.25X rated power for 5secs) 1.00% 0.10% Moisture Resistance MIL-STD-202 Method 106G 1.00% 0.25% MIL-STD-202 Method 107G Condition B 0.25% 0.05% MIL-STD-202 Method 210F 0.25% 0.05% Load Life High Temperature Exposure Thermal Shock Resistance to Soldering Heat Solderability MIL-STD-202 Method 208 (245°C, 5 seconds) >95% Coverage Note2 : 0.01W added for all resistance values <10W. General Note IRC reserves the right to make changes in product specification without notice or liability. All information is subject to IRC’s own data and is considered accurate at time of going to print. Advanced Film Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com A subsidiary of TTelectronics plc HTC Series Issue July 2009
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