High Temperature
Thick Film Chip Resistors
HTC Series
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Operation to 200°C
Excellent high temperature stability
Improved working voltage ratings
Pb-free wrap-around terminations
Standard chip sizes available from 1206 to 2512
Electrical Data
Characteristic
1206
2010
2512
1W to 10MW; ±1%, ±5%
Resistance Range
10W to 1MW; ±0.5%, ±5%, ±1%
150°C Power Rating
200mW
500mW
750mW
Max Voltage Rating
200V
400V
500V
Absolute TCR
± 100ppm/°C
Operating Temperature
Pad/Trace Area1
-55°C to +200°C
80mm2
Termination
200mm2
300mm2
Wrap-around Pb-free with leach resistant Ni barrier
Note1 : Recommended minimum pad and adjacent trace area for each termination for rated power on FR4 PCB.
Environmental Data
Test
Method
Specification
Maximum2
Typical
MIL-STD-202 Method 108
(Rated Power for 1000hrs @ 150°C)
1.00%
0.25%
1000 hours @ 200°C
1.00%
0.20%
Short Time Overload
MIL-PRF-55342H
(6.25X rated power for 5secs)
1.00%
0.10%
Moisture Resistance
MIL-STD-202 Method 106G
1.00%
0.25%
MIL-STD-202 Method 107G Condition B
0.25%
0.05%
MIL-STD-202 Method 210F
0.25%
0.05%
Load Life
High Temperature Exposure
Thermal Shock
Resistance to Soldering Heat
Solderability
MIL-STD-202 Method 208
(245°C, 5 seconds)
>95% Coverage
Note2 : 0.01W added for all resistance values <10W.
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
Advanced Film Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TTelectronics plc
HTC Series Issue July 2009
