512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM
Features
Mobile Low-Power SDR SDRAM
MT48H32M16LF – 8 Meg x 16 x 4 banks
MT48H16M32LF/LG – 4 Meg x 32 x 4 banks
Features
Options
Marking
• VDD/VDDQ: 1.8V/1.8V
• Addressing
– Standard addressing option
– Reduced page-size option1
• Configuration
– 32 Meg x 16 (8 Meg x 16 x 4 banks)
– 16 Meg x 32 (4 Meg x 32 x 4 banks)
• Plastic “green” packages
– 54-ball VFBGA (8mm x 9mm) 2
– 90-ball VFBGA (10mm x 13mm) 3
• Timing – cycle time
– 6ns at CL = 3
– 7.5ns at CL = 3
• Power
– Standard IDD2/IDD7
– Low-power IDD2/IDD71
• Operating temperature range
– Commercial (0˚C to +70˚C)
– Industrial (–40˚C to +85˚C)
• Revision
• VDD/VDDQ = 1.7–1.95V
• Fully synchronous; all signals registered on positive
edge of system clock
• Internal, pipelined operation; column address can
be changed every clock cycle
• Four internal banks for concurrent operation
• Programmable burst lengths: 1, 2, 4, 8, and continuous
• Auto precharge, includes concurrent auto precharge
• Auto refresh and self refresh modes
• LVTTL-compatible inputs and outputs
• On-chip temperature sensor to control self refresh
rate
• Partial-array self refresh (PASR)
• Deep power-down (DPD)
• Selectable output drive strength (DS)
• 64ms refresh period
Notes:
H
LF
LG
32M16
16M32
BF
CM
-6
-75
None
L
None
IT
:B
1. Contact factory for availability.
2. Available only for x16 configuration.
3. Available only for x32 configuration.
Table 1: Configuration Addressing
32 Meg x 16
16 Meg x 32
16 Meg x 32 Reduced
Page-Size Option1
Number of banks
4
4
4
Bank address balls
BA0, BA1
BA0, BA1
BA0, BA1
Row address balls
A[12:0]
A[12:0]
A[13:0]
Column address balls
Note: 1. Contact factory for availability
A[9:0]
A[8:0]
A[7:0]
Architecture
Table 2: Key Timing Parameters
Clock Rate (MHz)
Access Time
Speed Grade
CL = 2
CL = 3
CL = 2
CL = 3
-6
104
166
8ns
5ns
-75
104
1. CL = CAS (READ) latency
133
8ns
5.4ns
Note:
PDF: 09005aef82ea3742
512mb_mobile_sdram_y47m.pdf – Rev. H 12/09 EN
1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2007 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
