COPAL ELECTRONICS
SLIDE SWITCHES (SMD)
RoHS compliant
CJS
INTERNAL STRUCTURE
①
②
⑤
③
⑥
④
Part name
■FEATURES
Material
①
PPS(Polyphenylenesulphide)
②
Slider
PA(Polyamide)
③
Housing
④
Slider contact
⑤
Fixed contact
⑥
● RoHS compliant
● Easy to set slider with line marking
● With neutral detent type lined up to 1 pole 2contacts
switch
● Compatible with most automatic pick & place machinery
● Compact and space saving SMD type
Cover
Flammability
Terminal pin
UL-94V-0
PPS(Polyphenylenesulphide)
Copper alloy, Gold-plated
—
■PART NUMBER DESIGNATION
C J S - 1 2 0 1 T B 1
Series name
No. of poles
1：1 pole (SPDT)
Structure
1：Non-washable type (Without seal tape)
Standard type
2：Non-washable type (With seal tape)
Blank : Washable type (With seal tape)
No. of contacts
2：2 contacts
Setting position
0：Top setting
Shape of terminal
A：J-hook
B：Gull wing
Neutral detent
0：Without neutral detent
1：With neutral detent
Form of packaging
T：Taping (Reel)
Blank：Bulk in plastic bag
SPDT : Single Pole Double Throw
※Please refer to the LIST OF PART NUMBERS when placing orders.
■ Specifications are subject to change without notice. Specifications in this catalog are for reference. The formal specification sheets will be submitted upon request.
COPAL ELECTRONICS
CJS
SLIDE SWITCHES (SMD)
■STANDARD SPECIFICATIONS
■ELECTRICAL CHARACTERISTICS
Operating temp. range
Contact rating
Non-switching
Switching
Minimum
− 40 ~ 85 °C
Storage temp. range
Sealing
Net weight
Washable type available with seal tape
Contact resistance
Approx. 0.05g (CJS-1200)
Approx. 0.06g (CJS-1201)
Insulation resistance
Dielectric strength
■MECHANICAL CHARACTERISTICS
Operating force
DC50 V 100 mA
DC6 V, 100 mA DC24 V, 25 mA
DC20 mV 1 μA
100 mΩ maximum
100 MΩ (DC100 V) minimum
AC250 V, 60 s
■ENVIRONMENTAL CHARACTERISTICS
Vibration
5.9 N {0.6 kgf} maximum
490 m/s2, 11 ms
6 directions for 3 times each
Continuous load 200 cycles,
DC6 ± 0.5 V, 100 ± 10 mA
Stop strength
10 N {1.02 kgf}, 60 s
Solderability
245 ± 3 °C, 2 ~ 3 s
Load life
Reflow：255 °C (Peak temperature)
（Please refer to the profile below）
Humidity
Manual soldering：350 ± 10 °C, 3 ~ 4 s
High temp. exposure
85 °C, 96 h
Shear (Adhesion)
5 N {0.51 kgf} 10 s
Low temp. exposure
− 40 °C, 96 h
Substrate bending
Width 90 mm, bend 3 mm, 5 s, 1 time
Soldering heat
Pull-off strength
Shock
Amplitude 1.5mm or Acceleration 98m/s2,
10-500 Hz, 3 directions for 10 cycles each
Thermal shock
−10 ~ 65 °C, Relative humidity 0 ~ 96 %,
24 h for 10 cycles
− 40 (0.5 h) ~ 85 °C (0.5 h), 5 cycles
5 N {0.51 kgf} 10 s
{ } : Reference only
〈Reflow profile for soldering heat evaluation〉
(°C)
250
Peak : 250
+5
0
°C
Temperature
Over 230 °C
200
150
100
50
180 °C
150 °C
Pre Heating Zone
90 ± 30 s
30 ± 10 s
Heating time
Soldering Zone
Reflow : two times maximum
■ Specifications are subject to change without notice. Specifications in this catalog are for reference. The formal specification sheets will be submitted upon request.
