FDR8702H
20V N & P-Channel PowerTrench MOSFET
General Description
Features
These N & P-Channel MOSFETs are produced
using
Fairchild
Semiconductor’s
advanced
PowerTrench process that has been especially
tailored to minimize on-state resistance and yet
maintain superior switching performance.
• N channel
RDS(ON) = 38 mΩ @ VGS = 4.5 V
3.6 A, 20V
RDS(ON) = 54 mΩ @ VGS = 2.5 V
• P channel
RDS(ON) = 80 mΩ @ VGS = –4.5 V
RDS(ON) = 110 mΩ @ VGS = –2.5 V
–2.6 A, –20V
Applications
• Fast switching speed.
DC/DC converter
• High performance trench technology for extremely
Power management
low RDS(ON)
D
D
44
3
3
6
D
Q1(N)
7
TM
SuperSOT -8
G1
S1
G2
Absolute Maximum Ratings
Symbol
Q2(P)
5
D
2
2
1
1
8
S2
TA=25oC unless otherwise noted
Parameter
Ratings
Units
VDSS
Drain-Source Voltage
Q1 (N)
20
VGSS
Gate-Source Voltage
±12
±8
V
ID
Drain Current– Continuous
3.6
–2.6
A
PD
Power Dissipation for Single Operation
TJ, TSTG
Operating and Storage Junction Temperature Range
(Note 1a)
– Pulsed
Q2 (P)
–20
15
V
–10
0.8
W
–55 to +150
°C
146
76
°C/W
(Note 1b)
(Note 1)
40
(Note 1a)
Thermal Characteristics
RθJA
RθJC
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Case
(Note 1a)
Package Marking and Ordering Information
Device Marking
Device
Reel Size
Tape width
Quantity
.8702
FDR8702H
13’’
12mm
2500 units
2003 Fairchild Semiconductor Corp.
FDR8702H Rev C (W)
FDR8702H
March 2003
Symbol
A
= 25°C unless otherwise noted
Parameter
Test Conditions
Q
Min
Typ
Max
Units
Q1
0.7
A
Q2
Q1
Q2
Q1
Q2
Q1
Q2
Q1
Q2
–0.7
1.2
–1.2
Drain-Source Diode Characteristics
IS
Maximum Continuous Drain–Source Diode Forward Current
VSD
Drain-Source Diode Forward
Voltage
VGS = 0 V, IS = 0.7A, Note 2
VGS = 0 V, IS = –0.7A, Note 2
trr
Reverse Recovery Time
Irm
Maximum Reverse Recovery
Current
For Q1:
IF = 3.6A, dIF/dt = 100A/µs
Qrr
Reverse Recovery Charge
For Q2:
IF = –2.6A, dIF/dt = 100A/µs
0.7
–0.7
16
22
0.6
0.7
5
8
V
ns
A
nC
Notes:
1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design.
a)
76°C/W when
2
mounted on a 1in pad
of 2 oz copper
b)
146°C/W when mounted
on a minimum pad of 2 oz
copper
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%
FDR8702H Rev C (W)
FDR8702H
Electrical Characteristics T
