FPC Connectors
FP-10 SU Series CIC Type
SL
1.0mm Pitch (SMT)
● SU Series CFP24
-0150F (Upper Contact Type)
No. of Pins
B
A
1.0(Spacing)
1.5
5.2
3.4
(2.0)
C
0.3
2.4
1.0
2.4
D
● SL Series CFP25
-0150F (Lower Contact Type)
No. of Pins
B
A
■ Specifications
1. Rating : 0.5A, 100V AC/DC
2. Contact Resistance : 30mΩ max.
3. Insulation Resistance : 500MΩ min. at 500V DC
4. Withstanding Voltage : 500V AC (for one minute)
5. Operating Temperature Range : –30˚C to +85˚C
5.2
3.4
(2.0)
1.0(Spacing)
C
1.5
■ Material and Plating
Housing : Thermoplastic Resin,
Natural Color, 94V-0
● Cover : Thermoplastic Resin,
Natural Color, 94V-0
● Contact : Cu Alloy, Au Plating
● Hold down : Cu Alloy, SnCu Plating
1.7
●
0.3
2.4
No. of Pins
04
05
06
07
08
09
10
11
12
13
14
15
1.0
D
2.4
A
B
C
D
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0
11.0
12.0
13.0
14.0
5.1
6.1
7.1
8.1
9.1
10.1
11.1
12.1
13.1
14.1
15.1
16.1
9.7
10.7
11.7
12.7
13.7
14.7
15.7
16.7
17.7
18.7
19.7
20.7
4.5
5.5
6.5
7.5
8.5
9.5
10.5
11.5
12.5
13.5
14.5
15.5
■ P.C. Board Dimension
16
17
18
19
20
21
22
24
26
28
29
30
B
C
D
17.1
18.1
19.1
20.1
21.1
22.1
23.1
25.1
27.1
29.1
30.1
31.1
21.7
22.7
23.7
24.7
25.7
26.7
27.7
29.7
31.7
33.7
34.7
35.7
16.5
17.5
18.5
19.5
20.5
21.5
22.5
24.5
26.5
28.5
29.5
30.5
■ Applicable FPC Dimension
Silver ink/carbon paste : 10µm min.
0.5
3.0
2.0
0.25
2.4
A
15.0
16.0
17.0
18.0
19.0
20.0
21.0
23.0
25.0
27.0
28.0
29.0
No. of Pins
2.6
FPC plating to recommend : Au plating
.4
●
0.5
A
(D 0.6)
R0
1.0
4.0 min.
1. FPC connector usable with CIC (Carbon in
Circuit) printing.
2. Either upper or lower contact location available.
3. Low profile of 2.4mm height when mounted.
4. Using the ZIF structure.
5. Supplied in the embossed taping with automatic
mounter.
1.7
■ Features
1.0
A
(A 2)
0.7
1.0
19
