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A3P250-VQG100

製品説明
仕様・特性

v1.1 ® Automotive ProASIC3 Flash Family FPGAs Features and Benefits Low Power • 1.5 V Core Voltage • Support for 1.5-V-Only Systems • Low-Impedance Flash Switches High-Temperature AEC-Q100–Qualified Devices • Grade 2 105°C TA (115°C TJ) • Grade 1 125°C TA (135°C TJ) • PPAP Documentation High-Performance Routing Hierarchy • Segmented, Hierarchical Routing and Clock Structure • High-Performance, Low-Skew Global Network • Architecture Supports Ultra-High Utilization Firm-Error Immune • Only Automotive FPGAs to Offer Firm-Error Immunity • Can Be Used without Configuration Upset Risk Advanced I/O • • • • High Capacity • 60 k to 1 M System Gates • Up to 144 kbits of SRAM • Up to 300 User I/Os Reprogrammable Flash Technology • 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS Automotive Process • Live-at-Power-Up (LAPU) Level 0 Support • Single-Chip Solution • Retains Programmed Design when Powered Off • • • • • • • On-Chip User Nonvolatile Memory • 1 kbit of FlashROM with Synchronous Interface High Performance • 350 MHz System Performance • 3.3 V, 66 MHz 64-Bit PCI 700 Mbps DDR, LVDS-Capable I/Os 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation Bank-Selectable I/O Voltages—up to 4 Banks per Chip Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V / 2.5 V / 1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X, and LVCMOS 2.5 V / 5.0 V Input Differential I/O Standards: LVPECL, LVDS, B-LVDS, and M-LVDS (A3P250 and A3P1000) I/O Registers on Input, Output, and Enable Paths Hot-Swappable and Cold-Sparing I/Os Programmable Output Slew Rate and Drive Strength Weak Pull-Up/-Down IEEE 1149.1 (JTAG) Boundary Scan Test Pin-Compatible Packages across the Automotive ProASIC®3 Family Clock Conditioning Circuit (CCC) and PLL • Six CCC Blocks, One with an Integrated PLL • Configurable Phase Shift, Multiply/Divide, Delay Capabilities, and External Feedback • Wide Input Frequency Range (1.5 MHz up to 350 MHz) In-System Programming (ISP) and Security • Secure ISP Using On-Chip 128-Bit Advanced Encryption Standard (AES) Decryption via JTAG (IEEE 1532–compliant) • FlashLock® to Secure FPGA Contents (anti-tampering) SRAMs • Variable-Aspect-Ratio 4,608-Bit RAM Blocks (×1, ×2, ×4, ×9, and ×18 organizations available) Automotive ProASIC3 Product Family ProASIC3 Devices A3P060 A3P125 A3P250 A3P1000 System Gates 60 k 125 k 250 k 1M VersaTiles (D-flip-flops) 1,536 3,072 6,144 24,576 RAM kbits (1,024 bits) 18 36 36 144 4,608-Bit Blocks 4 8 8 32 FlashROM Bits 1k 1k 1k 1k Secure (AES) ISP Yes Yes Yes Yes Integrated PLL in CCCs 1 1 1 1 VersaNet Globals1 18 18 18 18 I/O Banks 2 2 4 4 Maximum User I/Os 96 133 157 300 VQ100 FG144 VQ100 FG144 QNG132 VQ100 FG144, FG256 QNG132 FG144, FG256, FG484 Package Pins VQFP FBGA QFN2 Notes: 1. Six chip-wide (main) globals and three additional global networks in each quadrant are available. 2. QFN packages are available as RoHS compliant only. December 2009 © 2009 Actel Corporation I

ブランド

ACTEL

現況

2010/10/05 - 米Microsemi Corp.と米Actel Corp.は,MicrosemiがActelを買収することで合意したと発表した

会社名

Microsemi Corp.

本社国名

U.S.A

事業概要

Microsemi provides industry-leading FPGAs and SoCs for general purpose applications in the industrial, communications, defense, medical and space markets with the lowest power, proven security and exceptional reliability

供給状況

 
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