F-217
FLE–110–01–G–DV
10 YEAR MFG
WITH 30 µ" GOLD
EXTENDED LIFE
PRODUCT
FLE–120–01–G–DV
FLE–150–01–G–DV
HIGH MATING
CYCLES
(1.27 mm) .050"
FLE SERIES
COST-EFFECTIVE RELIABLE SOCKET
SPECIFICATIONS
For complete specifications and
recommended PCB layouts
see www.samtec.com?FLE
Insulator Material:
Black Liquid
Crystal Polymer
Contact Material:
Phosphor Bronze
Plating:
Au over 50 µ" (1.27 µm) Ni
Current Rating:
2 A per pin
(6 adjacent pins powered)
Operating Temp Range:
-55 °C to +125 °C
Contact Resistance:
15 mW
Insertion Depth:
(1.83 mm) .072" to
(4.37 mm) .172" or
pass-through
Normal Force:
100 grams (0.98 N)
Max Cycles:
100+
RoHS Compliant:
Yes
PROCESSING
Board Mates:
FTSH, FTS, FW
Cable Mates:
FFMD*, FMTP
Surface
mount
* Note: Standard FFMD callout
FLE
1
Available with optional
pick & place pads
(1.27 mm) .050"
micro pitch
will not mate with FLE, SFMC.
Must use gold plated callouts.
(See drawing on web.)
Lead-Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max
NO. PINS
PER ROW
PLATING
OPTION
01
DV
RECOGNITIONS
–G
02 thru 50
= 10 µ" (0.25 µm) Gold
= Alignment Pin
(Metal or plastic at
Samtec discretion)
(3 positions minimum)
–K
= (4.25 mm) .167" DIA
Polyimide film
Pick & Place Pad
(5 positions minimum)
FILE NO: 090871_0_000
(6.35)
.250
x
(4.17)
.164
ALSO AVAILABLE
(MOQ Required)
• Other platings
Contact Samtec.
OPTIONS
–A
For complete scope
of recognitions see
www.samtec.com/quality
FILE NO. E111594
Ideal for
pass-through
applications
Tiger Beam™
contact
No. of Positions x (1.27) .050 + (0.11) .0045
(1.27)
.050
(1.27)
.050
–TR
(4.74)
.187
(3.33)
.131
= Tape & Reel
–P OPTION
(0.51)
.020
–P
= Metal Pick &
Place Pad
(5 positions minimum)
(4.55) (4.36)
.179 .172
(4.60)
.181
Note: Some lengths, styles
and options are non-standard,
non-returnable.
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.
