SN74LVC2G17
DUAL SCHMITT-TRIGGER BUFFER
www.ti.com
SCES381F – JANUARY 2002 – REVISED SEPTEMBER 2006
FEATURES
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Available in the Texas Instruments
NanoStar™ and NanoFree™ Packages
Supports 5-V VCC Operation
Inputs Accept Voltages to 5.5 V
Max tpd of 5.4 ns at 3.3 V
Low Power Consumption, 10-µA Max ICC
±24-mA Output Drive at 3.3 V
Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
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DBV PACKAGE
(TOP VIEW)
Typical VOHV (Output VOH Undershoot)
>2 V at VCC = 3.3 V, TA = 25°C
Ioff Supports Partial-Power-Down Mode
Operation
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 1000-V Charged-Device Model (C101)
YEA, YEP, YZA,
OR YZP PACKAGE
(BOTTOM VIEW)
DCK PACKAGE
(TOP VIEW)
1
6
1A
GND
2
5
VCC
2A
3
4
6
2
5
VCC
3
4
2A
3 4
GND
2 5
1A
1 6
1Y
2A
1Y
1
GND
1A
2Y
VCC
2Y
1Y
2Y
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This dual Schmitt-trigger buffer is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC2G17 contains two buffers and performs the Boolean function Y = A. The device functions as two
independent buffers, but because of Schmitt action, it may have different input threshold levels for positive-going
(VT+) and negative-going (VT–) signals.
ORDERING INFORMATION
PACKAGE (1)
TA
ORDERABLE PART NUMBER
NanoStar™ – WCSP (DSBGA)
0.17-mm Small Bump – YEA
NanoFree™ – WCSP (DSBGA)
0.17-mm Small Bump – YZA (Pb-free)
NanoStar™ – WCSP (DSBGA)
0.23-mm Large Bump – YEP
–40°C to 85°C
SOT (SC-70) – DCK
(1)
(2)
SN74LVC2G17YEAR
SN74LVC2G17YZAR
Reel of 3000
_ _ _C7_
SN74LVC2G17YEPR
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
SOT (SOT-23) – DBV
TOP-SIDE MARKING (2)
SN74LVC2G17YZPR
Reel of 3000
SN74LVC2G17DBVR
Reel of 250
SN74LVC2G17DBVT
Reel of 3000
SN74LVC2G17DCKR
Reel of 250
SN74LVC2G17DCKT
C17_
C7_
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2002–2006, Texas Instruments Incorporated
