PC400
PC400
Compact, Surface Mount Type
OPIC Photocoupler
s Features
s Outline Dimensions
1. Mini-flat package
2. “ Low ” output during light emission
3. Isolation voltage between input and output
( Viso : 3 750V rms )
4. TTL and LSTTL compatible output
5. Recognized by UL(No.E64380)
Internal connection
diagram
1.27 ± 0.25
6
5
4
Voltage regulator
PC400
2.54 ± 0.25
1. Hybrid substrate which requires high density mounting
2. Personal computers, office computers and
peripheral equipment
3. Electronic musical instruments
1
3
0.1 ± 0.1 2.6 ± 0.2
C0.4
( Input Side)
0.5 + 0.4
- 0.2
Diameter of reel
Tape width
Taping package
( Net:3 000pcs. )
φ 370mm
Taping package
( Net: 750pcs. )
φ 178mm
Sleeve package
( Net: 100pcs. )
-
4 Vo
5 GND
6 Vcc
* “ OPIC ” ( Optical IC ) is a trademark of the SHARP Corporation.
An OPIC consists of a light-detecting element and signalprocessing circuit integrated onto a single chip.
12mm
PC400Z
7.0 + 0.2
- 0.7
12mm
PC400T
5.3 ± 0.3
6˚
1 Anode
2 NC
3 Cathode
PC400
4
Amp.
0.4 ± 0.1
1
3
3.6 ± 0.3
s Package Specifications
5
0.2 ± 0.05
s Applications
6
4.4 ± 0.2
Anode mark
-
s Absolute Maximum Ratings
Input
Output
Parameter
Forward current
Reverse voltage
Power dissipation
Supply voltage
High level output voltege
Low level output current
Power dissipation
Total power dissipation
*1
Isolation voltege
Operating temperature
Storage temperature
*2
Soldering temperature
( Ta = 25˚C )
Symbol
IF
VR
P
V CC
V OH
I OL
PO
P tot
V iso
T opr
T stg
T sol
Rating
50
6
70
16
16
50
130
150
3 750
- 25 to + 85
- 40 to + 125
260
Unit
mA
V
mW
V
V
mA
mW
mW
V rms
˚C
˚C
˚C
0.2mm or more
Model No. Package specifications
( Unit : mm )
Soldering area
*1 AC for 1 minute, 40 to 60% RH
*2 For 10 seconds
“ In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that occur in equipment using any of SHARP's devices, shown in catalogs,
data books, etc. Contact SHARP in order to obtain the latest version of the device specification sheets before using any SHARP's device.”
