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120139284 Product Details
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FPC (Flexible Printed Circuit) Connectors
Always EU RoHS/ELV Compliant (Statement of Compliance)
120139284
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Product Highlights:
.30 mm Centerline
37 Positions
Gold Contact Plating, Mating Area, Material
Contact Plating, Mating Area, Thickness = .1 µm
Thermoplastic Housing Material
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TE Internal Number: 120139284
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Additional Information:
Product Information
Product Line Information
Related Products:
Tooling
Product Features (Please use the Product Drawing for all design activity)
Product Type Features:
PCB Mounting Orientation = Right Angle
PCB Mount Alignment = Without
PCB Mount Retention = Without
Actuator Type = Rear Flip (Front Hinge)
PCB Mount Retention Type = Solder Pads
Sealed = No
Electrical Characteristics:
Contact Current Rating, Max. (A) = 0.2
Operating Voltage Reference = AC
Operating Voltage (VAC) = 50
Termination Features:
Termination Method to PC Board = Surface Mount
Dimensions:
Flex Cable Thickness (mm [in]) = 0.2 [0.008]
Length (XAxis) (mm [in]) = 11.60 [0.456]
Width (ZAxis) (mm [in]) = 3.80 [0.1496]
Profile Height (YAxis) (mm [in]) = 0.90 [0.035]
Housing Features:
Centerline (mm [in]) = 0.30 [0.012]
Housing Material = Thermoplastic
Contact Mating Location = Bottom
Housing Color = Natural
Configuration Features:
Number of Positions = 37
Tail Orientation = Staggered
Shrouded = Yes
Shielded = No
Strain Relief = Without
Industry Standards:
RoHS/ELV Compliance = RoHS compliant, ELV compliant
Lead Free Solder Processes = Reflow solder capable to 245°C,
Reflow solder capable to 260°C
RoHS/ELV Compliance History = Always was RoHS compliant
Identification Marking:
Circuit Identification Feature = Without
Body Features:
Selectively Loaded = No
Environmental:
Operating Temperature (°C [°F]) = 25 – +85 [13 – +185]
Contact Features:
Contact Plating, Mating Area, Material = Gold
Contact Plating, Mating Area, Thickness (µm [μin]) = 0.1 [3.937]
Contact Plating, Termination Area, Material = Gold
Contact Plating, Termination Area, Thickness (µm [μin]) = 0.1 [3.93]
Contact Design = Single Beam
Contact Base Material = Copper Alloy
Operation/Application:
ZIF/NonZIF = ZIF
Contact Transmits (Typical Application) = Signal (Data)
Pick and Place Cover = Without
Packaging Features:
Packaging Method = Tape & Reel
Other:
Brand = TE Connectivity
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