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部品型式

MCH182FN104ZK

製品説明
仕様・特性

MCH18 Ceramic capacitors Multi-layer ceramic chip capacitors MCH18 (1608 (0603) size, chip capacitor) Features 1) Miniture, light weight 2) Achieved high capacitance by thin and multi layer technology 3) Lead-free plating terminal 4) No polarity Quick Reference The design and specifications are subject to change without prior notice. Please check the most recent technical specifications prior to placing orders or using the product. For more detail information regarding packaging style code, please check product designation. Thermal compensation Part No. Size code Temperature characteristics (ppm/°C) code Operating temp. range (°C) Rated voltage (V) 0±120(CJ) 0±60(CH) MCH18 1608 (0603) A (AN) 0±30 (CG)(C0G) −55 to +125 50 Capacitance (pF) 0.5 to 3.9 (E24 Series) ∗ 4 to 5 (E24 Series) ∗ 5.1 to 9.1 (E24 Series) ∗ 10 (E24 Series) ∗ 11 to 820 (E24 Series) 1,000 to 3,300 (E12 Series) Capacitance tolerance Thickness (mm) C(±0.25pF) D(±0.5pF) 0.8 ± 0.1 J(±5%) ∗ : 0.5pF/0.75pF/2pF/3pF/4pF/5pF/6pF/7pF/8pF/9pF available High dielectric constant Temperature characteristics CN MCH18 1608 (0603) −25 to +85 0±15% (R) (X7R) −55 to +125 50 25 50 25 −55 to +85 +30% , −80% (F) code Rated voltage (V) 0±15% (X5R) Size code Operating temp. range (°C) 0±10% (B) Part No. −25 to +85 FN +22% , −82% (Y5V) −30 to +85 10 6.3 50 25 16 10 6.3 50 25 16 10 6.3 Capacitance (pF) 220 to 22,000 (E6 Series) 33,000 to 100,000 (E6 Series) 220 to 100,000 (E6 Series) 33,000 to 100,000 (E6 Series) 150,000 to 470,000 (E6 Series) 680,000 to 1,000,000 (E6 Series) 2,200,000 (E6 Series) 1,000 to 47,000 (E3 Series) 100,000 (E3 Series) 220,000 (E3 Series) 470,000 to 2,220,000 (E3 Series) 4,700,000 (E3 Series) 1,000 to 47,000 (E3 Series) 100,000 (E3 Series) 220,000 (E3 Series) 470,000 to 2,200,000 (E3 Series) 4,700,000 (E3 Series) Capacitance tolerance K(±10%) Thickness (mm) 0.8 ± 0.1 +0.15 0.8 −0.1 Z(+80% , −20%) Rev.A 0.8 ± 0.1 1/14

ブランド

ROHM

会社名

ローム株式会社

本社国名

日本

事業概要

炭素皮膜抵抗の特許を元に創業した。社名のROHM(R:抵抗 Ohm:抵抗を示す単位)はそこに由来する。その後、大規模集積回路の製造を手がけ始め、現在は様々な機能を顧客の要望に応じてLSI上に集積するカスタムLSIが主力となっている。

供給状況

 
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