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NTLJF4156NTAG

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NTLJF4156N Power MOSFET and Schottky Diode 30 V, 4.6 A, mCool] N−Channel, with 2.0 A Schottky Barrier Diode, 2x2 mm WDFN Package http://onsemi.com MOSFET Features • WDFN Package Provides Exposed Drain Pad for Excellent Thermal • • • • • Conduction Co−Packaged MOSFET and Schottky For Easy Circuit Layout RDS(on) Rated at Low VGS(on) Levels, VGS = 1.5 V Low Profile (< 0.8 mm) for Easy Fit in Thin Environments Low VF Schottky This is a Pb−Free Device V(BR)DSS RDS(on) MAX ID MAX (Note 1) 70 mW @ 4.5 V 30 V 4.6 A 90 mW @ 2.5 V 125 mW @ 1.8 V 250 mW @ 1.5 V SCHOTTKY DIODE VR MAX Applications VF TYP IF MAX 30 V 0.47 V 2.0 A • DC−DC Converters • Li−Ion Battery Applications in Cell Phones, PDA’s, Media Players • Color Display and Camera Flash Regulators D A MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) Symbol Parameter Value Unit Drain−to−Source Voltage VDSS 30 V Gate−to−Source Voltage VGS ±8.0 V ID 3.7 A G Continuous Drain Current (Note 1) TJ = 25°C TJ = 85°C TJ = 25°C Power Dissipation (Note 2) SCHOTTKY DIODE 4.6 Steady State PD W 1.5 2.3 TJ = 25°C Steady State MARKING DIAGRAM TJ = 25°C t≤5s Continuous Drain Current (Note 2) N−CHANNEL MOSFET 2.7 t≤5s Power Dissipation (Note 1) Steady State K S ID TJ = 85°C 1 6 2 JLMG 5 3 4 G 1 WDFN6 CASE 506AN A 2.5 JL = Specific Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) PIN CONNECTIONS 1.8 PD 0.71 IDM 20 A TJ, TSTG −55 to 150 °C Source Current (Body Diode) (Note 2) IS 2.4 A Lead Temperature for Soldering Purposes (1/8″ from case for 10 s) TL 260 °C Pulsed Drain Current TJ = 25°C tp = 10 ms Operating Junction and Storage Temperature June, 2006 − Rev. 4 1 1 N/C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq [1 oz] including traces). 2. Surface Mounted on FR4 Board using the minimum recommended pad size of 30 mm2, 2 oz. Cu. © Semiconductor Components Industries, LLC, 2006 K A 6 2 K 5 G 4 S D D 3 (Top View) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet. Publication Order Number: NTLJF4156N/D

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