AXK(7/8)
NARROW PITCH
(0.4mm) CONNECTORS
P4 SERIES
NARROW-PITCH
CONNECTORS
FOR PC BOARDS
2. High impact-resistant construction.
1) Adoption of bellows-type contacts
structure.
The roll surfaces are in contact
with each other, providing high
contact reliability.
2) Guides are provided to take up any
position shift and facilitate insertion.
Insertion guide
Since the contact is formed by
bending thin plate, it has a springlike quality. This construction
helps make it resistant to dropping
and twisting.
2) It is constructed with impact dispersion
keys inside the body to disperse shocks
when dropped.
Socket
3) The connector has a simple lock
mechanism.
Impact dispersion Key
Header side
contact
Socket and
header are
mated
Socket
Header
Socket side
contact
Simple lock
mechanism
Ideal for FPC-to-PCB connections
Before
mating
After
mating
FPC
Reinforcing plate
Narrow-pitch
connectors
P4
The simple lock
mechanism ensures
that the connector
clicks into position
when it is inserted for
reliable single-action
insertion on the PCB.
Header
0.3mm
PCB
1.8mm
A stacking height of 1.8mm including
the FPC area has been achieved.
This enables the number of pins to
be doubled white the size remains
the same as that for existing FPC
connectors. This, in turn, contributes
to making products and equipment
more compact.
FEATURES
A high level of shock resistance is
ensured by dispersing impact over the
four locations where the socket indentations and header protrusions are mated
together.
3. Construction makes designing
devices easier.
1) The lower connector surface construction prevents contact and shorts between
the PCB and metal terminals. This
enables freedom in pattern wiring, helping to make PCB’s smaller.
1. A 0.4 mm pitch and stacking height
of 1.5 mm allow for extra compactness
and helps design lighter, thinner,
shorter, and smaller devices.
4. Design makes efficient mounting.
Features a terminal flatness of 0.08 mm,
construction resistant to creeping flux,
and design that facilitates visual inspection of the soldered part.
APPLICATIONS
• Cellular phones
• DVC
• Compact portable devices
Connector bottom: Create any thru-hole pattern wiring.
PRODUCT TYPES
Stacking height
No. of contacts
1.5 mm
20
24
26
30
34
40
50
60
70
80
100
Part No.
Socket
AXK720145∗
AXK724145∗
AXK726145∗
AXK730145∗
AXK734145∗
AXK740145∗
AXK750145∗
AXK760145∗
AXK770145∗
AXK780145∗
AXK700145∗
Packing
Header
AXK820145Y∗
AXK824145Y∗
AXK826145Y∗
AXK830145Y∗
AXK834145Y∗
AXK840145Y∗
AXK850145Y∗
AXK860145Y∗
AXK870145Y∗
AXK880145Y∗
AXK800145Y∗
Inner carton (1-reel)
Outer carton
Note 1)
“Asterisk” mark on end of part No.;
J: 3,000 pieces
V: 3,000 pieces
Note 1)
“Asterisk” mark on end of part No.;
J: 6,000 pieces
V: 15,000 pieces
Notes) 1. Regarding ordering units: During production, Please make orders in 1-reel units. Samples for mounting confirmation: Please consult us. (See “Regarding sample
orders to confirm proper mounting” on page 9.) Samples: Small lot orders are possible.
2. The standard type comes with no positioning bosses. Connectors with positioning bosses are available for on-demand production. For this type of connector, 8th
digit of the part no. changes from 4 to 3. e.g. Stacking height 1.5mm 20 contacts for sockets: AXK720135J
3. Connectors with holding metal are available for on-demand production.
13
AXK(7/8)
• Socket and header are mated
1.50±0.15
Stacking height 1.5 mm
EMBOSSED TAPE DIMENSIONS
Please refer to page 56.
• Socket
Recommended PC board pattern
(TOP VIEW)
0.40±0.05
Recommended PC board pattern
(TOP VIEW)
0.40±0.05
0.23±0.03
0.40±0.05
0.23±0.03
0.40±0.05
3.50±0.05
5.70±0.05
1. As shown below, excess force during insertion may result in damage to
the connector or removal of the solder.
Please be careful. Also, to prevent
connector damage plese confirm the
correct position before mating connectors.
• Header
2.96±0.05
4.56±0.05
NOTES
0.115±0.05
0.40±0.05
0.115±0.05
0.40±0.05
2. Keep the PC board warp no more
than 0.03 mm in relation to the overall
length of the connector.
B±0.05
B±0.05
Recommended metal mask pattern
Metal mask thickness: Here, 150 µm
Recommended metal mask pattern
Metal mask thickness: Here, 150 µm
(Opening area ratio: 40%)
(Opening area ratio: 32%)
±0.01
0.40
0.35±0.01
0.20±0.01
(0.30)
0.35±0.01
0.10±0.01
(0.30)
3.50±0.01
4.10±0.01
(0.51)
3. PC Boards and Recommended
Metal Mask Patterns
Connectors are mounted with high density, with a pitch interval of 0.4 to 0.5 mm.
It is therefore necessary to make sure
that the right levels of solder are used, in
order to reduce solder bridge and other
issues. The figures to the right are recommended metal mask patterns. Please use
them as a reference.
0.20±0.01
(0.51)
Max. 0.03mm
5.50±0.01
4.48±0.01
Max. 0.03mm
0.40±0.01
0.10±0.01
Recommended metal mask pattern
Metal mask thickness: Here, 120 µm
Recommended metal mask pattern
Metal mask thickness: Here, 120 µm
(Opening area ratio: 50%)
(Opening area ratio: 40%)
0.40±0.01
0.35±0.01
0.40±0.01
0.10±0.01
0.20±0.01
(0.37)
3.36±0.01
4.10±0.01
(0.63)
5.50±0.01
4.24±0.01
0.35±0.01
0.10±0.01
(0.37)
(0.63)
0.20±0.01
* See the dimension table on page 14 for more information on the B dimension of the socket and header.
Regarding general notes, please
refer to pages 8 and 9.
12/1/2002
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