3.5mm Dia. Jacks
■ Features
1. A small ø3.5mm jack that was developed for small, mobile
equipment.
2. A wide selection is available including surface mounting,
DIP, spring terminal, and mid mount types.
1.Electric Performance
Rating
: 1A, 12V DC
Contact Resistance
: 30mΩ max, 50mΩ max.
Insulation Resistance : 100MΩ min.500V DC
Withstanding Voltage : 500V AC(for one minute)
2.Mechanical Performance
Insertion Force
: 35N max. at 3.5mm Dia.gauge
Withdrawal Force
: 3 to 35N at 3.5mm Dia.gauge
■ Application
Smart phones, mobile phones, tablet PCs, portable audio,
other small AV equipment.
(LGY2209-0101F)
2
0
1
Circuits
2
3
4
1
Metal Sleeve
Without
With
2
3
1.8
le)
2(Ho
.
2-ø1
1.8
12
P.C. Board Dimension
(Top View)
Reflow Soldering
(500pcs/reel)
F
2
12
4.4
ø5
ø3.
2
3
4
1
ø1
.2
2.2
Circuits
2
4
2.4
7.5
1
3
3.5
2-
1.9
5.35
9
4-1.5x0.7
4-2
LGY2209-03
1
2
3.5
1.8
4
SMD Type
1.8
7.5
2
2
3
2.75
2.75
3
2
0.4
4.4
2.2
0.05 0.1
(Terminal position
range)
ø5
ø3.
9-0101F
5.35
LGY22
9
Mini Jacks
■ Specification
P.C. Board Dimension
(Bottom View)
2.4
[t=0.8]
DIP Type
12
00
40
Housing Color
Black
Yellow
Manual Soldering
3.5mm Dia. Jacks
LGY2109-3301F
6
2.6
1
0.5
4.2
2.1
ø5.5
ø3.6
Circuits
Mini Jacks
2
4
5
3
1
P.C. Board Dimension
(Top View)
DIP / SMD Type
Reflow Soldering
[t=0.8]
LGY2109-1801F
Circuits
2
4
5
3
1
6
2.5
2.5
3.2
2.2
3
3.4
4
Two 2.5x1.9
6x1.8
2.9
6
1
5
SMD Type
6.9
10.6
13.4
13.4
9.4
6.3
2
2.5
5.2
3.7
5.9
P.C. Board Dimension
(Top View)
(Land)
Reflow Soldering
(800pcs/reel)
LGY3509-0400F
ø5.5
ø3.6
2
12
0.5
0.65
5.55
3.45
6
2.5
8.7
Circuits
2xø1
2.4
2.2
3
4
5
2
1
1.9
2xø1.2
1
2
3
4
5.4
9.2
8.7 2.5
5.2
2x1.6x0.8
Through hole
5
2x2.4
2.1
DIP / SMD Type
(Land)
[t=0.7]
14
2.1
P.C. Board Dimension
(Top View)
Reflow Soldering