CD-TCE070-0908
Multi-layer Power Inductor : MIPSZ2012series (Very Small Type)
Features
• 2.0x1.2 mm and 1 mm in height (very compact size): CAE and
fine printing technology made this compact size possible
• Stable minimum DC resistance in the class
• High speed mounting: Using SMT mounter makes less than a
second mounting possible
• Excellent mounting strength by SMD chip making
• Reduced noise over 2/3 of coil inductor by optimal design of
CAD
• Completely lead-free product and support lead-free solder
Applications
• DC-DC converters and power modules used for the following
equipments.Compact electrical instruments such as cellular
phones, DSC,DVC, PDA, DVD and HDD.
Specifications
MIPSZ2012D
4R7
MIPSZ2012D
2R2
MIPSZ2012D
1R5
MIPSZ2012D
1R0
MIPSZ2012D
0R5
3.3± 30%
2.2 ± 30%
1.5± 30%
1.0 ± 30%
0.5 ± 30%
0.23 ± 30%
0.19 ± 30%
0.23 ± 30%
0.10± 30%
0.09 ± 30%
0.06 ± 30%
0.7
Inductance(uH)
at 1MHz
DC
resistance(ohm)
Rated
Current(A)*1
MIPSZ2012D
3R3
4.7 ± 30%
Product name
0.8
0.7
1.0
1.1
1.3
*1:In case temperature rise to 40℃ due to self-heating. Operating temperature range:-40～85℃.
Inductance vs. DC bias current
MIPSZ2012D4R7
MIPSZ2012D3R3
MIPSZ2012D2R2
MIPSZ2012D1R5
MIPSZ2012D1R0
MIPSZ2012D0R5
6
5
4
MIPSZ2012D4R7
MIPSZ2012D2R2
MIPSZ2012D1R0
7
6
Inductance(uH)
7
Inductance (uH)
Inductance vs. Frequnecy
3
2
MIPSZ2012D3R3
MIPSZ2012D1R5
MIPSZ2012D0R5
5
4
3
2
1
1
0
0
0
200
400
600
800
1000
0.1
1
DC bias curre nt(mA)
Frequency(MHz)
Shapes and Dimensions
Recommended land pattern
2.0 ± 0.2
3.2―0.2
1.0 max
Standard package : Emboss taping (reel)
1.3
1.25 ± 0.2
0.3∼0.8
2.11.3
―0.4
2.3
4.0―0.3
■ The description in this catalogue is subject to change without notice.
http://www.fdk.co.jp
10
(mm)
(mm)
As of July, 2009
100
