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部品型式

74ABT823DB

製品説明
仕様・特性

SN54ABT823, SN74ABT823 9-BIT BUS-INTERFACE FLIP-FLOPS WITH 3-STATE OUTPUTS SCBS158E – JANUARY 1991 – REVISED MAY 1997 D D D D D D SN54ABT823 . . . JT OR W PACKAGE SN74ABT823 . . . DB, DW, OR NT PACKAGE (TOP VIEW) OE 1D 2D 3D 4D 5D 6D 7D 8D 9D CLR GND These 9-bit flip-flops feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing wider buffer registers, I/O ports, bidirectional bus drivers with parity, and working registers. With the clock-enable (CLKEN) input low, the nine D-type edge-triggered flip-flops enter data on the low-to-high transitions of the clock. Taking CLKEN high disables the clock buffer, thus latching the outputs. Taking the clear (CLR) input low causes the nine Q outputs to go low, independently of the clock. 24 2 23 3 22 4 21 5 20 6 19 7 18 8 17 9 16 10 15 11 14 12 13 VCC 1Q 2Q 3Q 4Q 5Q 6Q 7Q 8Q 9Q CLKEN CLK SN54ABT823 . . . FK PACKAGE (TOP VIEW) 5 3 2 1 28 27 26 25 6 24 7 23 8 22 9 21 4 description 1 2D 1D OE NC VCC 1Q 2Q D State-of-the-Art EPIC-ΙΙB ™ BiCMOS Design Significantly Reduces Power Dissipation ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0) Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17 Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C High-Impedance State During Power Up and Power Down High-Drive Outputs (–32-mA IOH, 64-mA IOL) Buffered Control Inputs to Reduce dc Loading Effects Package Options Include Plastic Small-Outline (DW) and Shrink Small-Outline (DB) Packages, Ceramic Chip Carriers (FK) and Flatpacks (W), and Standard Plastic (NT) and Ceramic (JT) DIPs 3D 4D 5D NC 6D 7D 8D 10 20 11 19 12 13 14 15 16 17 18 3Q 4Q 5Q NC 6Q 7Q 8Q 9D CLR GND NC CLK CLKEN 9Q D NC – No internal connection A buffered output-enable (OE) input can be used to place the nine outputs in either a normal logic state (high or low logic level) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without need for interface or pullup components. When VCC is between 0 and 2.1 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 2.1 V, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. The SN54ABT823 is characterized for operation over the full military temperature range of –55°C to 125°C. The SN74ABT823 is characterized for operation from –40°C to 85°C. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. EPIC-ΙΙB is a trademark of Texas Instruments Incorporated. Copyright © 1997, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN54ABT823, SN74ABT823 9-BIT BUS-INTERFACE FLIP-FLOPS WITH 3-STATE OUTPUTS SCBS158E – JANUARY 1991 – REVISED MAY 1997 logic diagram (positive logic) OE CLR CLKEN CLK 1 11 14 R 13 C1 1D 2 23 1Q 1D To Eight Other Channels Pin numbers shown are for the DB, DW, JT, NT, and W packages. absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Voltage range applied to any output in the high or power-off state, VO . . . . . . . . . . . . . . . . . . . –0.5 V to 5.5 V Current into any output in the low state, IO: SN54ABT823 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA SN74ABT823 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –18 mA Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA Package thermal impedance, θJA (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104°C/W DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81°C/W NT package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these or any other conditions beyond those indicated in the “recommended operating conditions” section of this specification is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. The package thermal impedance is calculated in accordance with EIA/JEDEC Std JESD51, except for through-hole packages, which use a trace length of zero. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3

ブランド

PHILIPS

現況

2006年8月フィリップス社が半導体部門を投資家グループに売却しKASLION Acquisition B.V.の名称で法人化。2010年5月 社名を現在のNXPセミコンダクターズN.V.に変更。

現ブランド

NXP

会社名

NXP Semiconductors

本社国名

オランダ

事業概要

高性能ミックスドシグナルICのほか、ディスクリートなどの汎用製品をグローバルに提供している。

供給状況

 
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