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74F32
54F 74F32 Quad 2-Input OR Gate General Description Features This device contains four independent gates each of which performs the logic OR function Y Commercial Guaranteed 4000V minimum ESD protection Package Number Military N14A 14-Lead (0 300 Wide) Molded Dual-In-Line J14A 14-Lead Ceramic Dual-In-Line 74F32SC (Note 1) M14A 14-Lead (0 150 Wide) Molded Small Outline JEDEC 74F32SJ (Note 1) M14D 14-Lead (0 300 Wide) Molded Small Outline EIAJ et 54F32DM (Note 2) e 74F32PC Package Description 54F32FM (Note 2) W14B 14-Lead Cerpack 54F32LM (Note 2) E20A 20-Lead Ceramic Leadless Chip Carrier Type C Note 1 Devices also available in 13 reel Use suffix e SCX and SJX Note 2 Military grade device with environmental and burn-in processing Use suffix e DMQB FMQB and LMQB Connection Diagrams bs ol Logic Symbol IEEE IEC Pin Assignment for DIP SOIC and Flatpak Pin Assignment for LCC TL F 9463–3 O TL F 9463 – 2 TL F 9463 – 1 Unit Loading Fan Out Pin Names Description An Bn On Inputs Outputs 54F 74F UL HIGH LOW Input IIH IIL Output IOH IOL 10 10 50 33 3 20 mA b0 6 mA b 1 mA 20 mA TRI-STATE is a registered trademark of National Semiconductor Corporation C1995 National Semiconductor Corporation TL F 9463 RRD-B30M75 Printed in U S A 54F 74F32 Quad 2-Input OR Gate December 1994 AC Electrical Characteristics 74F Symbol Parameter 54F 74F TA e a 25 C VCC e a 5 0V CL e 50 pF TA VCC e Mil CL e 50 pF TA VCC e Com CL e 50 pF Min tPLH tPHL Propagation Delay An Bn to On Typ Max Min Max Min Max 30 30 42 40 56 53 30 25 75 75 30 30 66 63 Units ns Ordering Information The device number is used to form part of a simplified purchasing code where the package type and temperature range are defined as follows 74F 32 S X Special Variations QB e Military grade device with environmental and burn-in processing X e Devices shipped in 13 reels e Temperature Range Family 74F e Commercial 54F e Military C Device Type Temperature Range C e Commercial (0 C to a 70 C) M e Military (b55 C to a 125 C) et Package Code P e Plastic DIP D e Ceramic DIP F e Flatpak L e Leadless Chip Carrier (LCC) S e Small Outline SOIC JEDEC SJ e Small Outline SOIC EIAJ O bs ol Physical Dimensions inches (millimeters) 20-Lead Ceramic Leadless Chip Carrier (L) NS Package Number E20A 3
TI
Texas Instruments Incorporated
U.S.A
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