Precision Thin Film
Chip Resistors
Precision Thin Film
PFC Series
Chip Resistors
Ultra stable Tantalum Nitride
IRC Advanced Film Division
· Standard 60/40 Sn/Pb and Pb-free
resistor film system
(RoHS compliant) terminations available
PFC Series
Available in 0402, 0603, 0805 and 1206
Standard 60/40 COTSand Pb-free (RoHS compliant) terminations available
Tested for Sn/Pb applications
Available in 0402, 0603, 0805 and 1206
Absolute TCR to ±10ppm/°C
Tested for COTS applications
MIL screening available
Absolute TCR to ±10ppm/°C
MIL screeninganti-sulfuration characteristics
Superior available
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Ultra stable Tantalum Nitride
resistor film system
Non-leaching
Nickel barrier
Wrap around
termination
Non-leaching
Nickel barrier
Superior anti-sulfuration characteristics
Wrap around
termination
The IRC TaNFilm® PFC chip resistor series provides the high precision and ultra stable performance of our
Tantalum Nitride resistive film system in 0402, 0603, 0805 and 1206 sizes. The unique characteristics of the
passivated Tantalum Nitride film ensure long term life stability and reliability in most environments.
Qualified for resistance to sulfur bearing gases, the PFC series is an excellent solution for automotive and
heavy equipment applications where precision, exceptional reliability with anti-sulfuration characteristics
is imperative.
Using the same manufacturing line as the PFC Military Series, IRC’s precision chips maintain the same supe
rior environmental performance. Specially selected materials and processes insure initial precision is main
tained in the harshest surface mount soldering environment. Wrap-around terminations with leach-resistant
nickel barriers insure high integrity solder connections.
Electrical Data
Model
Power Rating
(70°C)
Max Voltage
P x R)
Rating (
W0402
50mW
100mW
75V
W0805
250mW
100V
W1206
333mW
ESD
Sensitivity
75V
W0603
Temperature
Range
200V
-65°C to +150°C
2KV to 4KV
(HBM)
Noise
Termination
Substrate
<-25dB
100% matte tin
(RoHS
compliant)
plated over
nickel barrier
99.5%
Alumina
Environmental Data
Environmental Test
Performance
Test Method
Typical
Maximum
Sulfuration Test
ASTM B-809 (Modified) 105°C Dry, 1000 Hours
±0.02%
±0.05%
Thermal Shock
MIL-PRF-55342
±0.02%
±0.10%
Low Temperature Operation
MIL-PRF-55342
±0.01%
±0.05%
Short Time Overload
MIL-PRF-55342
±0.01%
±0.05%
High Temperature Exposure
MIL-PRF-55342
±0.03%
±0.10%
Effects of Solder
MIL-PRF-55342
±0.01%
±0.10%
Moisture Resistance
MIL-PRF-55342
±0.03%
±0.10%
Life
MIL-PRF-55342
±0.03%
±0.10%
General Note
IRC reserves the right to make changes in product specification without notice or liability .
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
T
General Note
F
Texas 78411 USA
Website: www.irctt.com
TT electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT electronics’ own data and is considered accurate at time of going to print.
A subsidiary of
TT electronics plc
PFC Series Issue August 2011 Sheet 1 of 4
www.bitechnologies.com www.irctt.com www.welwyn-tt.com
© TT electronics plc
09. 11
