FEATURES
FUNCTIONAL BLOCK DIAGRAMS
1.5 Ω on resistance
0.3 Ω on-resistance flatness
0.1 Ω on-resistance match between channels
Continuous current per channel
LFCSP package: up to 400 mA
TSSOP package: up to 260 mA
Fully specified at +12 V, ±15 V, and ±5 V
No VL supply required
3 V logic-compatible inputs
Rail-to-rail operation
16-lead TSSOP and 4 mm × 4 mm, 16-lead LFCSP packages
ADG1436
S1A
D1
S1B
IN1
IN2
S2A
D2
S2B
APPLICATIONS
SWITCHES SHOWN FOR A ONE-INPUT LOGIC.
06817-001
Data Sheet
1.5 Ω On Resistance,
±15 V/12 V/±5 V, iCMOS, Dual SPDT Switch
ADG1436
Figure 1. TSSOP Package
Automatic test equipment
Data acquisition systems
Battery-powered systems
Sample-and-hold systems
Audio signal routing
Communication systems
Relay replacement
ADG1436
S1A
S2A
D2
D1
S2B
S1B
IN1
IN2
EN
SWITCHES SHOWN FOR A ONE-INPUT LOGIC.
06817-002
LOGIC
Figure 2. LFCSP Package
GENERAL DESCRIPTION
The ADG1436 is a monolithic CMOS device containing two
independently selectable SPDT switches. An EN input on the
LFCSP package enables or disable the device. When disabled, all
channels are switched off. Each switch conducts equally well in
both directions when on and has an input signal range that
extends to the supplies. In the off condition, signal levels up to
the supplies are blocked. Both switches exhibit break-beforemake switching action for use in multiplexer applications.
The ADG1436 is designed on an iCMOS® process. iCMOS
(industrial-CMOS) is a modular manufacturing process combining
high voltage CMOS (complementary metal-oxide semiconductor)
and bipolar technologies. It enables the development of a wide
range of high performance analog ICs capable of 33 V operation
in a footprint that no previous generation of high voltage parts
has been able to achieve. Unlike analog ICs using conventional
Rev. B
CMOS processes, iCMOS components can tolerate high supply
voltages while providing increased performance, dramatically
lower power consumption, and reduced package size.
The on-resistance profile is very flat over the full analog input
range, ensuring excellent linearity and low distortion when
switching audio signals. iCMOS construction ensures ultralow
power dissipation, making the part ideally suited for portable
and battery-powered instruments.
PRODUCT HIGHLIGHTS
1.
2.
3.
4.
2.6 Ω maximum on resistance over temperature.
Minimum distortion.
Ultralow power dissipation: <0.03 μW.
16-lead TSSOP and 16-lead 4 mm × 4 mm LFCSP packages.
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