SMBJ5.0 thru 188CA
Surface Mount TRANSZORB®
Transient Voltage Suppressors
DO-214AA (SMB J-Bend)
Stand-off Voltage 5.0 to 188V
Peak Pulse Power 600W
Cathode Band
0.155 (3.94)
0.130 (3.30)
0.086 (2.20)
0.077 (1.95)
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Mounting Pad Layout
0.180 (4.57)
0.160 (4.06)
0.083 MIN
(2.10 MIN)
0.012 (0.305)
0.006 (0.152)
0.096 (2.44)
0.084 (2.13)
0.106 MAX
(2.69 MAX)
0.050 MIN
(1.27 MIN)
Dimensions in inches
and (millimeters)
0.220 REF
0.060 (1.52)
0.030 (0.76)
0.220 (5.59)
0.205 (5.21)
0.008
(0.203)
Max.
Features
Mechanical Data
Case: JEDEC DO-214AA molded plastic over
passivated junction
Terminals: Solder plated, solderable per
MIL-STD-750, Method 2026
Polarity: For unidirectional types the band denotes the
cathode, which is positive with respect to the anode
under normal TVS operation
Weight: 0.003oz., 0.093g
Packaging Codes – Options (Antistatic):
51 – 2K per Bulk box, 20K/carton
52 – 750 per 7” plastic Reel (12mm tape), 15K/carton
5B – 3.2K per 13” plastic Reel (12mm tape), 32K/carton
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
• Low profile package with built-in strain relief for surface
mounted applications
• Glass passivated junction
• Low incremental surge resistance, excellent clamping
capability
• 600W peak pulse power capability with a 10/1000µs
waveform, repetition rate (duty cycle): 0.01%
• Very fast response time
• High temperature soldering guaranteed:
250°C/10 seconds at terminals
• Contact local sales office for gull-wing (SMBG prefix)
lead form (DO-215AA)
Devices for Bidirectional Applications
For bi-directional devices, use suffix C or CA (e.g. SMBJ10C, SMBJ10CA). Electrical characteristics apply in both directions.
.
Maximum Ratings & Thermal Characteristics Ratings at 25°C ambient temperature unless otherwise specified.
Parameter
Symbol
Value
Unit
Peak pulse power dissipation with
a 10/1000µs waveform(1)(2) (Fig. 1)
PPPM
Minimum 600
W
Peak pulse current with a 10/1000µs waveform(1)
IPPM
See Table Below
A
Peak forward surge current 8.3ms single half sine-wave
uni-directional only (2)
IFSM
100
A
Typical thermal resistance, junction to ambient(4)
RθJA
100
°C/W
Typical thermal resistance, junction to lead
RθJL
20
°C/W
TJ, TSTG
–55 to +150
°C
Operating junction and storage temperature range
Notes: (1) Non-repetitive current pulse, per Fig.3 and derated above TA = 25°C per Fig. 2
(2) Mounted on 0.2 x 0.2” (5.0 x 5.0mm) copper pads to each terminal
(3) Mounted on minimum recommended pad layout
10/17/01