Fixed Inductors (Chip Inductors)
4. High Power Type PF, PE, PC, PA, PB, LC, LA
Discontinued ：Wirewound Chip Inductor. ELJPC, ELJPA, ELJPB, ELJLC, ELJLA
■ Features
● Low DCR and large current capability, suitable for power circuitry.
● Wire wound, resin molded chip inductor. (PC, PA, PB, LC, LA type)
● Unique Ceramic Core/Laser-cut technology (PF, PE type)
● Capable of being Re-flow or flow soldered.
● Wide line-up from 1005 to 4532 case sizes.
● Good for mounting.
● RoHS compliant
■ Recommended Applications
● AV equipment, Wireless communication equipment and various types of general electronic equipment.
■ Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
11
Packaging Design No.
Product code
Chip Inductors
Shape
Inductance
PF
1005 (0402)
1N5
Inductance tolerance
1.5 nH
D
F
Taping
±0.3 nH
PE
1608 (0603)
10N
10 nH
J
±5 %
PC
2520 (1008)
R22
220 nH
K
±10 %
LC
2520 (1008)
3R3
3.3 μH
M
±20 %
PA
3225 (1210)
470
47 μH
LA
3225 (1210)
561
560 μH
PB
4532 (1812)
Size : mm (inch)
■Storage Conditions
● Package
: Normal temperature (–5 to 35 °C), normal humidity (85 %RH max.), shall not be exposed to
direct sunlight and harmful gases and care should be taken so as not to cause dew.
● Operating Temperature : –40 to +85 °C (PF, PE)
–20 to +85 °C (PC, PA, PB, LC, LA)
■Storage Period
● Solderability may be reduced due to the conditions of high temperature and high humidity which causes the oxidation
of tin-plated terminals. Even if storage conditions are within specified limits, solderability may be reduced with the
passage of time. Therefore, please control the storage conditions and try to use the product within 6 months of receipt.
■Packaging Methods, Soldering Conditions and Safety Precautions
Please see Data Files.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
03 Sep. 2012
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