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USBLC6-2SC6
USBLC6-2 Very low capacitance ESD protection Features ■ 2 data-line protection ■ Protects VBUS ■ Very low capacitance: 3.5 pF max. ■ Very low leakage current: 150 nA max. ■ SOT-666 and SOT23-6L packages ■ RoHS compliant SOT23-6L USBLC6-2SC6 Figure 1. SOT-666 USBLC6-2P6 Functional diagram (top view) Benefits I/O1 ■ ■ ■ Enhanced ESD protection: IEC 61000-4-2 level 4 compliance guaranteed at device level, hence greater immunity at system level ■ ESD protection of VBUS ■ High reliability offered by monolithic integration ■ Low leakage current for longer operation of battery powered devices ■ Fast response time ■ Consistent D+ / D- signal balance: – Very low capacitance matching tolerance I/O to GND = 0.015 pF – Compliant with USB 2.0 requirements IEC 61000-4-2 level 4: – 15 kV (air discharge) – 8 kV (contact discharge) October 2011 I/O1 2 5 VBUS 3 4 I/O2 Applications ■ USB 2.0 ports up to 480 Mb/s (high speed) ■ Compatible with USB 1.1 low and full speed ■ Ethernet port: 10/100 Mb/s ■ Complies with the following standards: ■ 6 I/O2 Low PCB space consumption: 2.9 mm2 max for SOT-666 and 9 mm² max for SOT23-6L 1 GND Very low capacitance between lines to GND for optimized data integrity and speed SIM card protection ■ Video line protection ■ Portable electronics Description The USBLC6-2SC6 and USBLC6-2P6 are monolithic application specific devices dedicated to ESD protection of high speed interfaces, such as USB 2.0, Ethernet links and video lines. The very low line capacitance secures a high level of signal integrity without compromising in protecting sensitive chips against the most stringently characterized ESD strikes. Doc ID 11265 Rev 5 1/14 www.st.com 14
SAMSUNG
Samsung Electronics Co., Ltd
韓国
DRAM製品、モバイル機器の製造販売メーカー
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