1N3016B thru 1N3051B, e3
1 WATT METAL CASE ZENER DIODES
SCOTTSDALE DIVISION
APPEARANCE
This well established zener diode series for the 1N3016 thru 1N3051
JEDEC registration in the metal case DO-13 package provides a glass
hermetic seal for 6.8 to 200 volts. It is also well suited for high-reliability
applications where it is available in JAN, JANTX, and JANTXV military
qualifications. Lower voltages are also available in the 1N3821 thru
1N3830 series (3.3 V to 7.5 V) in the same package (see separate data
sheet). Microsemi also offers numerous other Zener diode products for a
variety of other packages including surface mount.
DO-13
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DESCRIPTION
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
FEATURES
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APPLICATIONS / BENEFITS
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Zener Voltage Range: 6.8V to 200V
Hermetically sealed DO-13 metal package
Internally solder-bonded construction.
Also available in JAN, JANTX, JANTXV qualifications
per MIL-PRF19500/115 by adding the JAN, JANTX,
or JANTXV prefixes to part numbers for desired level
of screening, e.g. JANTX1N3016B,
JANTXV1N3051B, etc.
Surface mount also available with 1N3016BUR-1 thru
1N3051BUR-1 series on separate data sheet
RoHS Compliant devices available by adding “e3” suffix
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MAXIMUM RATINGS
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MECHANICAL AND PACKAGING
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CASE: DO-13 (DO-202AA), welded, hermetically
sealed metal and glass
FINISH: All external surfaces are Tin-Lead (Pb/Sn)
or RoHS Compliant annealed matte-Tin (Sn) plating
and solderable per MIL-STD-750 method 2026
POLARITY: Cathode connected case.
WEIGHT: 1.4 grams.
Tape & Reel option: Standard per EIA-296 (add
“TR” suffix to part number)
See package dimensions on last page
For further mounting reference options, thermal resistance from junction to metal case is < 20 oC/W
when mounting DO-13 metal case directly on heat sink.
Copyright © 2006
3-12-2006 REV B
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1
1N3016B – 1N3051B, e3
Operating Junction and Storage Temperatures:
-65oC to +175oC
THERMAL RESISTANCE: 50oC/W* junction to lead
at 0.375 inches (10 mm) from body or 110 oC/W
junction to ambient when leads are mounted on FR4
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PC board with 4 mm copper pads (1 oz) and track
width 1 mm, length 25 mm
DC Power Dissipation*: 1.0 Watt at TL < +125oC 3/8”
(10 mm) from body or 1.0 Watts at TL < +65oC when
mounted on FR4 PC board as described for thermal
resistance above (also see Fig 1)
Forward Voltage @ 200 mA: 1.5 Volts.
Solder Temperatures: 260 o C for 10 s (maximum)
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Regulates voltage over a broad operating current
and temperature range
Wide selection from 6.8 to 200 V
Tight voltage tolerances available
Low reverse (leakage) currents
Nonsensitive to ESD
Hermetically sealed metal package
Inherently radiation hard as described in
Microsemi MicroNote 050
