512Mb : x32 TwinDie Mobile SDRAM Addendum
Features
Mobile SDRAM
MT48LC16M32L2 – 4 Meg x 32 x 4 Banks
MT48V16M32L2 – 4 Meg x 32 x 4 Banks
MT48H16M32L2 – 4 Meg x 32 x 4 Banks
Features
Addendum Changes
•
•
•
•
•
•
The standard 256Mb SDRAM Mobile x32 data sheets
should be referenced for a complete description of
SDRAM functionality and operating modes. This
addendum data sheet will concentrate on the key differences required to support the enhanced options of
the TwinDie configuration.
•
•
•
•
•
•
•
•
•
•
Low voltage power supply
Partial array self refresh power-saving mode
Temperature compensated self refresh (TCSR)
Deep power-down mode
Programmable output drive strength
Fully synchronous; all signals registered on positive
edge of system clock
Internal pipelined operation; column address can
be changed every clock cycle
Internal banks for hiding row access/precharge
Programmable burst lengths: 1, 2, 4, 8, or full page
Auto precharge, includes concurrent auto
precharge, and auto refresh modes
Self refresh mode; standard and low power
64ms, 8,192-cycle refresh
LVTTL-compatible inputs and outputs
Operating temperature range
Industrial (-40°C to +85°C)
Supports CAS latency of 1, 2, 3
Options
The Micron 256Mb Mobile X32 data sheet provides full
specifications and functionality unless specified
herein.
Table 1:
Speed
Grade
PDF: 09005aef817f1b8c/Source: 09005aef818112f1
512Mb Mobile SDRAM_TwinDie_x32.fm - Rev. C 6/05 EN
Clock
Frequency
-8
-10
125 MHz
100 MHz
Table 2:
Marking
• VDD/VDDQ
3.3V/3.3V
2.5V/2.5V
1.8V/1.8V
• Configuration
16M32 stacked die
• Package/ballout
Plastic package 90-ball FBGA
(8mm x 13mm) (standard)
Plastic package 90-ball FBGA
(8mm x 13mm) (lead-free)
• Timing (cycle time)
8ns at CL3 (125 MHz)
10ns at CL3 (100 MHz)
• Temperature
Commercial (0°C to +70°C)
Industrial (-40°C to +85°C)
Key Timing Parameters
Configuration
Refresh Count
Row Addressing
Bank Addressing
Column Addressing
L2
7.5ns
7.5ns
8.5ns
8.5ns
Configuration
Architecture
LC
V
H
Access Time Access Time
at CL = 3
at CL = 2
16 Meg x 32
4 Meg x 32 x 4 banks
8K
8K (A0–A12)
4 (BA0, BA1)
512 (A0–A8)
F5
B5
-8
-10
No Marking
IT
1
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2004 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.