C TYPE CHIP FUSE
Type 06CT
1.55mmx 0.8mm (0603)
Slow Blow Fuse Series
Patent
Feature
Material
Thin Film structure design with ceramic body and copper &
tinalloy element
Offer wide range of current ratings from 0.2A-5A & voltage up
to 32 VDC
Special multi-layer construction makes the fusing
characteristics stable
Good explosion-proof & Scratch durable characteristics
Suitable for both lead / lead-free reflow and wave soldering
process
Products meet 100% RoHS, HF & REACH requirement
Operating temperature range: -55°C to +125°C
Construction Body Material: Ceramic
Termination Material: Copper(Cu),Nickel(Ni),Tin(Sn)
Fuse Element: Copper(Cu),Tin(Sn)
Marking
06CT.200
06CT.500
06CT.750
06CT 001
06CT 1.50
06CT 002
06CT 2.50
06CT 003
06CT 004
06CT 005
C
F
G
H
K
N
O
P
S
T
Ampere
Rating
[ In ]
200mA
500mA
750mA
1A
1.5A
2A
2.5A
3A
4A
5A
Voltage
Rating
(V)
32V
Nominal
Resistance
Cold Ohms
1.900
0.350
0.145
0.090
0.040
0.024
0.019
0.013
0.009
0.005
Nominal
2
Melting I t
2
A Sec
0.010
0.044
0.067
0.095
0.210
0.321
0.631
0.900
1.920
2.375
Recommended Land Pattern
0.43 ± 0.1 mm
Catalog
Number
Dimension
Reflow Solder
Tape and Reel Specification
Item
A
B
W
E
F
P0
Unit:mm
P1
P2
T
10P0
1.080 1.880 8.000 1.750 3.500 4.000 4.000 2.000 1.550
0.600 40.000
Max
1.130
1.930
8.100
1.800 3.550 4.100
4.100 2.050
1.600
0.630
40.100
Min
Approval
1.030
1.830
7.900
1.700 3.450 3.900
3.900 1.950
1.500
0.570
39.900
Criterion
0.050
-0.050
0.050
-0.050
0.100
-0.100
0.050
-0.050
0.050
-0.050
0.100
-0.100
0.100
-0.100
0.050
-0.050
UL Recognized 0.2A~5A
Electrical Characteristic
1 ln
2 ln
3 ln
Rated
current
MIN
MAX
MAX
0.2A~5A
4 hr
120 sec
3 sec
Environmental Temperature at 25°C
Interrupting Rating
0.2A~1A : 50 amperes at 32V DC
1.5A~5A : 35 amperes at 32V DC
Tape & Reel Quantity
5000 pcs/reel
Environmental Specification
Soldering Method
Operating Temperature
*Reflow Soldering : 260°C, 30Sec. max.
*Wave Soldering : 260°C, 10Sec. max.
*Hand Soldering : 350°C, 3Sec. max.
Thermal Shock
-55°C to +125°C
MIL-STD-202G,Method 107,Condition B
(-65°C to +125°C)
Vibration
MIL-STD-202G,Method 204,Test Condition C
Moisture Resistance
MIL-STD-202G,Method 106,10 day cycle
Solderability
IPC-J-STD-002C
41
D0
0.050
-0.050
0.030
-0.030
0.100
-0.100