MJD31, MJD31C (NPN),
MJD32, MJD32C (PNP)
MJD31C and MJD32C are Preferred Devices
Complementary Power
Transistors
DPAK For Surface Mount Applications
http://onsemi.com
Designed for general purpose amplifier and low speed switching
applications.
SILICON
POWER TRANSISTORS
3 AMPERES
40 AND 100 VOLTS
15 WATTS
Features
•
•
•
•
•
•
•
Lead Formed for Surface Mount Applications in Plastic Sleeves
Straight Lead Version in Plastic Sleeves (“1” Suffix)
Lead Formed Version in 16 mm Tape and Reel (“T4” Suffix)
Electrically Similar to Popular TIP31 and TIP32 Series
Epoxy Meets UL 94, V−0 @ 0.125 in
ESD Ratings: Human Body Model, 3B u 8000 V
Machine Model, C u 400 V
Pb−Free Packages are Available
MARKING
DIAGRAMS
4
DPAK
CASE 369C
STYLE 1
DPAK−3
CASE 369D
STYLE 1
1 2
MAXIMUM RATINGS
3
Rating
Symbol
Collector−Emitter Voltage
Vdc
VCB
Emitter−Base Voltage
4
40
100
Vdc
40
100
MJD31, MJD32
MJD31C, MJD32C
YWW
J3xxG
Unit
VCEO
MJD31, MJD32
MJD31C, MJD32C
Collector−Base Voltage
Max
YWW
J3xxG
1
2
VEB
5
Vdc
Collector Current − Continuous
− Peak
IC
3
5
Adc
Base Current
IB
1
Adc
Total Power Dissipation @ TC = 25°C
Derate above 25°C
PD
15
0.12
W
W/°C
Total Power Dissipation @ TA = 25°C
Derate above 25°C
PD
1.56
0.012
W
W/°C
TJ, Tstg
−65 to
+ 150
3
°C
Operating and Storage Junction
Temperature Range
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected.
Y
WW
xx
G
= Year
= Work Week
= 1, 1C, 2, or 2C
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
Preferred devices are recommended choices for future use
and best overall value.
THERMAL CHARACTERISTICS
Symbol
Max
Unit
Thermal Resistance, Junction−to−Case
Characteristic
RqJC
8.3
°C/W
Thermal Resistance, Junction−to−Ambient*
RqJA
80
°C/W
TL
260
°C
Lead Temperature for Soldering Purposes
*These ratings are applicable when surface mounted on the minimum pad sizes
recommended.
© Semiconductor Components Industries, LLC, 2005
June, 2005 − Rev. 6
1
Publication Order Number:
MJD31/D
