August 1998
FDC6325L
Integrated Load Switch
General Description
Features
VDROP=0.2V @ VIN=5V, IL=1.5A. R(ON) = 0.13Ω
VDROP=0.2V @ VIN=3.3V, IL=1.2A. R(ON) = 0.16Ω
VDROP=0.2V @ VIN=2.5V, IL=1A. R(ON) = 0.18Ω.
This device is particularly suited for compact power
management in portable electronic equipment where
2.5V to 8V input and 1.8A output current capability are
needed. This load switch integrates a small N-Channel
power MOSFET (Q1) which drives a large P-Channel
power MOSFET (Q2) in one tiny SuperSOTTM-6
package.
SOT-23
SuperSOTTM-6
SuperSOTTM-6 package design using copper lead
frame for superior thermal and electrical capabilities.
SuperSOTTM -8
SO-8
SOIC-16
SOT-223
EQUIVALENT CIRCUIT
V in,R1
5
.32
3
4
Vout,C1
Q2
O N / O FF
2
V DROP
-
OUT
Vout,C1
1
5
+
IN
R2
Q1
O N / O FF
R1,C1
6
pin 1
TM
See Application Circuit
SuperSOT -6
Absolute Maximum Ratings
TA = 25°C unless otherwise noted
Symbol
Parameter
VIN
Input Voltage Range
FDC6325L
VON/OFF
On/Off Voltage Range
IL
Load Current
PD
Maximum Power Dissipation
TJ,TSTG
Operating and Storage Temperature Range
ESD
Electrostatic Discharge Rating MIL-STD-883D Human Body
Model (100pf/1500Ohm)
(Note 1)
- Pulsed
(Note 1 & 3)
V
1.5 - 8
- Continuous
Units
2.5 - 8
V
1.8
A
5
0.7
W
-55 to 150
(Note 2)
°C
6
kV
THERMAL CHARACTERISTICS
RθJA
Thermal Resistance, Junction-to-Ambient
(Note 2)
180
°C/W
RθJC
Thermal Resistance, Junction-to-Case
(Note 2)
60
°C/W
© 1998 Fairchild Semiconductor Corporation
FDC6325L Rev.D1
Typical Electrical Characteristics (TA = 25 OC unless otherwise noted )
0.5
0.5
0.4
0.4
TA = 125°C
V DROP , (V)
V DROP , (V)
TA = 125°C
0.3
TA =25°C
0.2
0
TA =25°C
0.2
0
0
1
2
3
V IN =3.3V
V ON/OFF = 1.5 - 8V
PW =300us, D≤ 2%
0.1
V IN = 5V
V ON/OFF = 1.5 - 8V
PW =300us, D≤ 2%
0.1
0.3
4
0
1
2
0.5
0.6
V DROP ,(V) / R ON ,(Ohm)
TA = 125°C
V DROP , (V)
0.4
TA =25°C
0.3
0.2
0.4
0.3
0.2
T =125°C
A
TA = 25°C
0
0
1
2
3
I L = 1A
V ON/OFF = 1.5 - 8V
PW =300us, D≤ 2%
0.5
0.1
V IN =2.5V
V ON/OFF = 1.5 - 8V
PW =300us, D≤ 2%
0.1
4
1
2
3
Figure 3. Conduction Voltage Drop
Variation with Load Current.
r(t), NORMALIZED EFFECTIVE
4
5
V IN ,(V)
I L ,(A)
TRANSIENT THERMAL RESISTANCE
4
Figure 2. Conduction Voltage Drop
Variation with Load Current.
Figure 1. Conduction Voltage Drop
Variation with Load Current.
0
3
I L ,(A)
I L ,(A)
Figure 4. On-Resistance Variation
with Input Voltage.
1
0.5
D = 0.5
0.2
0.2
0.1
0.05
0.02
0.01
RθJA (t) = r(t) * R θJA
RθJA = See Note 2
0.1
P(pk)
0.05
t1
0.02
0.01
t2
TJ - TA = P * R θJA(t)
Duty Cycle, D = t 1/ t 2
Single Pulse
0.005
0.00001
0.0001
0.001
0.01
0.1
1
10
100
300
t 1, TIME (sec)
Figure 5. Transient Thermal Response Curve.
Thermal characterization performed on the conditions described in Note 2.
Transient thermal response will change depends on the circuit board design.
FDC6325L Rev.D1
